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Digital Engineering Best Practices for Aerospace & Defense
Register for this Cadence TECHTALK™ webinar, where senior director of solutions marketing Frank Schirrmeister will discuss how commercial electronics hardware companies use cutting-edge design techniques to ensure that their hardware/software designs work as intended prior to fabrication. This ensures that hardware is built right the first time, in an affordable, sustainable, and agilely modernizable fashion.… Digital Engineering Best Practices for Aerospace & Defense
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Overcoming PCIe 6.0 System Integration and Pre-Silicon Validation Challenges
PCIe, the most popular interconnect in compute, AI and storage systems, is now offering faster data rate, higher performance, lower power and lower latency than the previous generation. Because of these reasons and the addition of PAM-4 signaling, challenges such as signal integrity, power integrity, implementation, IP integration and more must be considered when designing… Overcoming PCIe 6.0 System Integration and Pre-Silicon Validation Challenges
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Rambus Design Summit 2022
Join us at Rambus Design Summit Back for its third year, the Rambus Design Summit is a virtual conference focused on the selection and implementation of chip and IP solutions for the data center, edge, automotive and IoT devices including the acceleration and security of AI/ML applications. Hear our technology leaders give their insights on… Rambus Design Summit 2022
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From Cross-Platform Specification to Code Generation at the Enterprise Level
Learn how to capture your register and sequence specifications for IPs and SoCs from the individual IP to the enterprise level using IDS-NextGen™ .
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Complete STA Workshop with OpenSTA
In this program you will get access to: 10 hours of training videos access for the lifetime Access to reading material with sample codes for the lifetime 1.5hr Q/A sessions every day of the workshop Telegram Cohort Group for the duration of the workshop to ask questions doubts Assignments and labs to with instructor help… Complete STA Workshop with OpenSTA
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AI-Driven Verification: Saving Time with Verdi Regression Debug Automation
Analyzing the thousands of failures from daily regression runs is a manual, tedious, and error-prone process. The process can significantly impact quality-of-results, time-to-results and cost-of-results. The Synopsys Verdi® Regression Debug Automation (RDA) is an artificial intelligence (AI) driven verification technology for automating the process of finding the root causes of failures in the design under… AI-Driven Verification: Saving Time with Verdi Regression Debug Automation
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EMC+SIPI 2022
The Spokane Convention Center 334 W Spokane Falls Blvd, Spokane, WA, United StatesEMC+SIPI 2022 leads the industry in providing state-of-the-art education on EMC and Signal Integrity and Power Integrity techniques. On behalf of the IEEE EMC Society, I invite you to join us over August 1-5, 2022 in beautiful Spokane, Washington for our annual symposium. After two years of virtual symposia, we are looking forward to meeting… EMC+SIPI 2022
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Flash Memory Summit
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesProgram It is ideal for consumer applications such as cellphones, digital cameras, and music players, and is also useful in computers, communications systems, and military/defense applications. It can replace hard disks for storage in applications where its higher cost is balanced by its smaller size, greater ruggedness, and lower power consumption. The summit consists of:… Flash Memory Summit
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Advanced Physical Design using OpenLANE/Sky130
Physical Design or PnR (Place and Route) is the core of any IC design cycle. From a RTL netlist to final tape-out, each phase of PnR brings it’s own challenges and surprises. “What are these challenges?” “What is the process?” “Can I build a chip of my own?”- If you have these questions and if… Advanced Physical Design using OpenLANE/Sky130
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A Smart and Automatic Assembly and Connections for SoCs
Learn how to automatically assemble and connect IPs from many different sources at your SoC level using SoC Enterprise™. This includes automatic generation of components such as aggregators, bridges, channels, bus fabrics, muxes, etc. wherever needed.
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2022 R2: What’s New in Ansys Signal & Power Integrity
About this Event The 2022 R2 Ansys Signal and Power Integrity release introduces significant simulation improvements for electronic printed circuit boards, IC packages, and interposers. Ansys SIwave delivers new features, including a new blending algorithm for AC-DC transition, enhancements for DDR Wizard, which now supports IBIS AMI models, RLCG matrix reduction operations in CPA, and… 2022 R2: What’s New in Ansys Signal & Power Integrity
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Has the Time for Analog Automation Finally Come?
The semiconductor industry is experiencing explosive growth, driven by emerging applications such as AI, 5G, IoT and automotive. To keep pace, design teams have deployed sophisticated CAD tools that can implement digital designs comprising billions of transistors. However, while digital design has been extensively automated, analog continues to require handcrafting by experts. In this talk… Has the Time for Analog Automation Finally Come?
12 events found.