Calendar of Events
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The 2023 Design and Verification Conference and Exhibition United States (DVCon U.S.), sponsored by Accellera Systems Initiative, announces its call for extended abstract proposals. The submission site for extended abstracts will be open from July 11 through August 8, 2022. DVCon U.S. 2023 will be held February 27-March 2, 2023, at the Doubletree Hotel in San Jose, California.… DVCon U.S. 2023 
MWC Barcelona is the largest and most influential event for the connectivity ecosystem. Whether you’re a global mobile operator, device manufacturer, technology provider, vendor, content owner, or are simply interested in the future of tech, you need to be here. Why? Because it’s the one time of year where everyone who’s anyone comes together under… Mobile World Conference, MWC 2023 |
3 events,
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The use of advanced verification tools can significantly reduce the number of non-trivial bugs, save engineering time and resources and, more importantly, increase the reliability of FPGA designs. Static design verification is an essential part of a robust verification process that includes advanced linting and Clock Domain Crossing (CDC) analysis. In this webinar, we will… Linting and Clock Domain Crossing Analysis for Microchip FPGA Designs |
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The demand for efficient and scalable chip production has never been greater. The need to scale at volume and adapt to shorter innovation cycles makes machine learning and advanced data analytics essential components of semiconductor production. Join us on Tuesday, March 7, 2023, for this 1-hour panel discussion with industry experts from Qualcomm, Microsoft Azure and Advantest as we discuss… THE DATA REVOLUTION OF SEMICONDUCTOR PRODUCTION |
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MumbaiFOSS is a conference which aims to bring software developers, communities, policy makers and enthusiasts together, so we can learn and inspire each other. This event is happening in collaboration with FOSSEE, IIT Bombay. Agenda for MumbaiFOSS FOSS Product Showcase Deep Dive of Issues and Trends in Open Source Interact with the larger FOSS Community… MumbaiFOSS |
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3 events,
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… 19th Annual Device Packaging Conference (DPC 2023) 
SEMI-THERM is an international symposium dedicated to the thermal management and characterization of electronic components and systems. SEMI-THERM provides knowledge covering all thermal scales from integrated circuits to facilities, fosters discussions between thermal engineers, professionals, and industry experts, and encourages the exchange of information on academic and industrial advances in electronics cooling. Symposium Highlights Technical… SEMI-THERM 
The most comprehensive event this spring for microelectronics assembly & advanced packaging returns to Fountain Hills, Arizona. The 19th Annual Device Packaging Conference (DPC 2023) will be held March 13-16, 2023, at the WeKoPa Conference Center. This esteemed event brings together industry engineers, researchers and top experts participating in a multi-faceted technical program and unique networking events. Full… 19th International Conference & Exhibition on Device Packaging |
5 events,
The embedded world Exhibition&Conference provides a global platform and a place to meet for the entire embedded community, including leading experts, key players and industry associations. It offers unprecedented insight into the world of embedded systems, from components and modules to operating systems, hardware and software design, M2M communication, services, and various issues related to… Embedded World
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This will be an on-line event. We'll be the RISC-V Bivy virtual meeting system. The use of a microphone and/or camera are not required to participate in the event, chat will be monitored. We'll be discussing current and future hardware releases, state of various software projects, and plans for future meetups. We're also going to… March Austin RISC-V Meetup |
5 events,
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Doulos Co-Founder & Technical Fellow John Aynsley will teach the core principles necessary to understand and use SystemVerilog Assertions, focussing on the aspects of SVA that are applicable to both formal verification and simulation. Particular emphasis will be placed on the core semantics of temporal logic so that you will be able to write your own assertions,… Become an SVA Expert in One Hour |
5 events,
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Businesses across the globe faced a host of new challenges during the recent pandemic. As the pandemic wanes, we are now faced with recession as high inventories and low demand could mean trouble for semiconductor chip manufacturers. Join us to hear industry leaders and market experts discuss the outlook and the impact on semiconductor design and manufacturing supply chain… Semiconductor Outlook: Navigating Through Turbulent Times and the Impact of the Recession |
2 events,
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Get ready for our next RISC-V meetup, this time again as physical meeting. One day after the doors of Embedded World close, we will meet to bring together RISC-V enthusiasts from Munich, Bavaria and the world. Please get in touch with the organizers if you want to present! |
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GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being developed by the Department of Defense and other government agencies and has been used to announce major government microelectronics initiatives such as VHSIC and MIMIC, and provides a forum for… GOMACTech 2023 |
5 events,
The ninth Automotive Ethernet Congress to be held on March 21 - 23, 2023 at the Hilton Munich Airport will look to address the following questions: Does the selected transmission technology support the transformation of the E/E architecture from hardware-based to software-centric? Does it offer the necessary flexibility and self-learning capability to be able to continuously… Automotive Ethernet Congress
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Proper Power Strategy for Layouts comes with several requisites that pose great difficulty and are hard to balance without compromising on one or more aspects. Power strategy adds difficulty to an already complex process of floor-planning and is a time and labour-intensive implementation. It poses many challenges like hard to meet EM/IR specifications for a… PG Pcells- A Correct by Construction Power and Ground Distribution Strategy
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In this webinar, we will show how the SysML behavior models of a RADAR application can be mapped to a architecture model to measure the latency, throughput, power consumption, scheduling quality and response to bottleneck conditions. The application can be quickly mapped onto different architectures to meet the project requirements. This will enable better tuning… Mapping SysML to hardware architecture
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The recent surge in demand for mobile, networking, edge computing and automotive chips has challenged engineers to innovate across multiple domains – power efficiency, footprint and die cost. Meanwhile, the semiconductor shortage has increased wafer costs and fabrication times, thereby shortening design cycles and making first-pass success a must-have. Shrunk time to market has pushed… Synopsys: AMS SIG India – 10th Edition |
3 events,
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Presenter: Anupam Chattopadhyay Title: Electronic Design Automation for Emerging Technologies Abstract: The continued scaling of horizontal and vertical physical features of silicon-based complementary metal-oxide-semiconductor (CMOS) transistors, termed as “More Moore”, has a limited runway and would eventually be replaced with “Beyond CMOS” technologies. There has been a tremendous effort to follow Moore’s law but it is currently… Electronic Design Automation for Emerging Technologies |
4 events,
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In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping, with a focus on designs that utilize silicon interposers.… Thermal Integrity Challenges and Solutions of Silicon Interposer Design
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In this webinar, we will present the benefits of adopting SmartSpice’s unique 4-terminal TFT compact model, and we will also describe how SmartSpice Flex Modeling technology can be used to simulate image retention issues. Many TFT technologies in the market today are based on 4-terminal devices, while SPICE simulators from other vendors can only support… Learn About Advanced TFT-Based Flat Panel Design with SmartSpice |
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3 events,
For 60 years, IRPS has been the premiere conference for engineers and scientists to present new and original work in the area of microelectronics reliability. Drawing participants from the United States, Europe, Asia, and all other parts of the world… IRPS 2023 will be presented as an in-person conference, with a virtual component available. The… IRPS 2023 
We are happy to announce that once again the International Electrostatic Discharge Workshop (IEW) will be co-locating with IRPS this year. Their submission deadline is January 23, 2023. For further details, including the Call for Posters, please visit their webpage here. 
General Information The International Symposium on Physical Design (ISPD) provides a premier forum to exchange ideas and promote innovative research in all aspects of physical design ranging from traditional topics for ASIC and FPGA designs to emerging technologies that impact physical design of integrated circuits (ICs). In 2023, ISPD will be online with virtual participation,… International Symposium on Physical Design (ISPD) 2023 |
5 events,
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Semiconductor companies have long recognized the importance of yield management and having the right support in place to maximize results. In this 30-minute webinar brought to you by yieldHUB and SemiWiki, attendees will learn about a key to success in the world of yield management (and something that can be underestimated) - collaboration. This is… Maximizing yields through collaboration
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The ESD Alliance Export Committee will hold a seminar called “The Impact of New Regulations on the Semiconductor Design Ecosystem.” This seminar is presented by the ESD Alliance, a SEMI Technology Community, and will be hosted by Cadence Design Systems at their San Jose Headquarters. The Cadence Government and Trade Team will cover general trade compliance… ESD Alliance Export Seminar |
6 events,
Since 1991, the Synopsys Users Group (SNUG) has represented a global design community focused on innovating from Silicon to Software. Today, as the electronics industry’s largest user conference, SNUG brings together over 12,000 Synopsys tool and technology users across North America, Europe, Asia, and Japan. In addition to peer-reviewed technical presentations and insightful keynotes from… SNUG Silicon Valley 2023
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TechNES is pleased to announce the next FPGA Front Runners event – to he hosted by Leonardo at their venue in Edinburgh on March 29th, and will focus on FPGA Design using High Level Languages. The FPGA Front runners is all about bringing together the UK FPGA & ASIC design communities to discuss all things… FPGA Frontrunner Meet & Greet
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About Siemens Tessent DFT Forum 2023 India Presenting silicon lifecycle solutions from Siemens EDA: Engineering a smarter future faster Join us for the Siemens Tessent Design-for-Test (DFT) India Tech Forum, being held in Hotel Radisson Blu, Marathalli ORR, Bengalur India, on 29th March, 2023 learn from Industry leaders, fellow designers and experts from Siemens about how to leverage the Tessent… Siemens Tessent DFT Forum 2023 India |
5 events,
Standard Level - 2 sessions (4 hours per session including breaks) With thanks to AMD Xilinx for sponsoring this workshop: It is available to attend FREE OF CHARGE (Usual price $990) March 30-31 2023 - Americas - Register Now » March 30-31 2023 - EurAsia - Register Now » The Versal® Adaptive SoC from AMD Xilinx is multi-featured, offering… Versal Adaptive SoCs ONLINE WORKSHOP
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Driven by the trend towards software-defined vehicles (SDV), more complex software stacks are now being integrated into innovative automotive E/E architectures. Today the early integration testing of automotive software is already supported by using virtual ECUs (vECUs). However, the production basic software (BSW) is often not included because the virtualization of the hardware-specific microcontroller abstraction layer (MCAL)… How to Achieve Seamless Deployment of Level 3 Virtual ECUs for Automotive Digital Twins |
2 events,
The FOSSi Foundation is proud to announce Latch-Up, a conference dedicated to free and open source silicon to be held over the weekend of Friday, March 31 to Sunday, April 2, 2023 in Santa Barbara, California, USA. Latch-Up is a weekend of presentations and networking for the open source digital design community, much like its European sister conference ORConf. So… Latch-Up 2023 |
1 event,
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