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2.5D Packaging
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Signal Integrity Issues for Silicon Interposers
The development of applications like high-performance computing, Artificial Intelligence (AI) processors, and Central Processing Unit (CPU) and Graphical Processing Unit (GPU) chips involves advanced packaging technologies that radically alter traditional… Signal Integrity Issues for Silicon Interposers
Protocol and Memory Interface Verification in the Shrinking World of 3DIC
Emerging 2.5D and 3DIC packaging technologies enable more design complexity, and bring some new verification challenges. We look at how to scale your verification capability to match and how to… Protocol and Memory Interface Verification in the Shrinking World of 3DIC