AWR
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Thermal Analysis for MMIC and RF PCB Power Applications
Overview The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs. Thermal analysis provides RF circuit designers with insight regarding operating temperatures that can degrade performance and threaten device reliability. This webinar will highlight how the Celsius Thermal Solver uses design… Thermal Analysis for MMIC and RF PCB Power Applications
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Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation
The Cadence® AWR® V16 for RF Design Excellence Webinar Series introduces the latest capabilities in Cadence® AWR Design Environment® Version 16 (V16), providing ready access to Cadence Clarity™ 3D Solver and Celsius™ Thermal Solver for unconstrained capacity to solve large-scale and complex RF systems directly from within the RF design platform. Our next webinar in… Advanced Antenna Design and Integration Through Circuit/EM Co-Simulation
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Intelligent Cross-Platform Workflows for RF PCB Integration
The last webinar in The Cadence® AWR® V16 for RF Design Excellence Webinar Seriesintroduces groundbreaking cross-platform workflows from AWR® software to Allegro® PCB Designer, which help to deliver up to a 50% reduction in turnaround time compared to competing solutions. RF IP integration within a larger mixed-signal PCB system is hampered by disjointed workflows between… Intelligent Cross-Platform Workflows for RF PCB Integration