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Thermal Analysis for MMIC and RF PCB Power Applications
October 5, 2021 @ 11:00 am - 12:00 pm PDT
Overview
The Cadence® Celsius™ Thermal Solver is now integrated with the Cadence AWR Design Environment® V16 platform, supporting electrothermal analysis for MMIC/RFIC, PCB, and module designs. Thermal analysis provides RF circuit designers with insight regarding operating temperatures that can degrade performance and threaten device reliability.
This webinar will highlight how the Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Cadence Microwave Office® software to provide designers with thermal heat map visualization and operating temperature information. By using the Celsius Thermal Solver with Microwave Office software, RF designers have access to critical data impacting performance and reliability concerns and can investigate heat sinking strategies to best manage thermal dissipation.
Date and Time
Tuesday, October 5, 2021
11:00 AM PDT/ 2:00 PM EDT