Cadence
Proactively Address Thermal Concerns in Advanced IC Packages
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find that IC packages may overheat if they do not carefully plan for heat dissipation. This webinar will show how design… Proactively Address Thermal Concerns in Advanced IC Packages
IEEE 32nd Asian Test Symposium
With the test technology facing its grand challenges to ensure the quality of ICs and electronic systems, incorporating more and more sophisticated manufacturing processes and system integration technologies in various emerging applications such as Internet of Things, cloud computing, automotive electronics, etc., global proliferation and cooperation is increasingly more important. The Asian Test Symposium (ATS)… IEEE 32nd Asian Test Symposium
EPEPS 2023
Sonesta San Jose - Milpitas 777 Bellew Drive, Milpitas, CA, United StatesEPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Electronics Packaging Society, IEEE Microwave… EPEPS 2023
Jasper User Group 2023
Ready to share and discuss the latest design and verification best practices with your peers from around the world? It’s time for our annual CadenceCONNECT: Jasper™ User Group Conference, held on October 18 and 19 at the Cadence San Jose campus. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers from around… Jasper User Group 2023
Soar to New Heights of Productivity using Cadence Managed Cloud Services
Date: Wednesday, October 18, 2023 Time: 8:30am PT | 10:30am CT | 11:30am ET Join us for this 45-minute webinar to learn how the Cadence-managed, EDA-optimized, ready-to-use, and secure ISO-certified cloud platform delivers a fully integrated and proven environment to jump-start product design, verification, and implementation. See the platform in action as we demo the productivity features… Soar to New Heights of Productivity using Cadence Managed Cloud Services
The Race is On!
Brazos Hall East 4th Street, Austin, TX, United StatesEvent Overview Date: Wednesday, October 18, 2023 Time: 8:30am – 4:00pm, followed by an exclusive networking event Location: Brazos Hall, Austin, TX There is an unprecedented demand for advanced-node chip design that pushes beyond traditional boundaries. Computing power, security, reliability, and other multifaceted requirements have surpassed the basic performance, power consumption, and area constraints of traditional chip design. The… The Race is On!
System-Level Thermal Signoff from Chips Through to Racks
Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems… System-Level Thermal Signoff from Chips Through to Racks
Samsung Foundry Forum 2023 EMEA
Sofitel Munich Bayerpost Bayerstrasse 12, Munich, GermanyWe're inviting global partners and customers to our upcoming Samsung Foundry Forum (SFF) and Samsung Advanced Foundry Ecosystem (SAFE™) Forum 2023. The events will provide opportunities to share insights and innovative technologies to build a strong foundry ecosystem to accelerate innovation beyond boundaries. Join us to experience the spirit and power of innovation. SFF &… Samsung Foundry Forum 2023 EMEA
SemIsrael Expo 2023
Avenue Convention Center Airport City, IsraelSemIsrael Expo 2023 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry. The Expo will host some 750 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups, local R&D offices of multinationals and IDMs, foundries,… SemIsrael Expo 2023
ICCAD 2023
Hyatt Regency San Francisco Downtown SoMa 50 3rd Street, San Francisco, CA, United StatesJointly sponsored by IEEE and ACM, ICCAD is the premier forum to explore new challenges, present leading-edge innovative solutions, and identify emerging technologies in the electronic design automation research areas. ICCAD covers the full range of CAD topics – from device and circuit level up through system level, as well as post-CMOS design. ICCAD has… ICCAD 2023
STAC Summit
The Metropolitan Club 233 South Wacker Drive, Chicago, IL, United StatesSTAC Summits bring together CTOs and other industry leaders responsible for solution architecture, infrastructure engineering, application development, machine learning/deep learning engineering, data engineering, and operational intelligence to discuss important technical challenges in trading and investment. WHEN Tuesday, October 31, 2023 STAC Exchange (Exhibits) opens at 8:30am CDT Conference starts at 9:00am CDT Networking lunch at… STAC Summit
Enhance Verification Quality with the Xcelium Mixed-Signal App
The comprehensive verification of analog mixed-signal (AMS) designs has challenges in schedules and implementations due to the vast divergence in design flows of the analog and digital portions of the SoC. These discrepancies include priorities in simulation cycles (accuracy versus performance), design methodologies, and verification of functionality. Over multiple decades, design verification (DV) has evolved… Enhance Verification Quality with the Xcelium Mixed-Signal App