System-Level Thermal Signoff from Chips Through to Racks

Dr. Melika Roshandell is product marketing director for Celsius Thermal Solver software at Cadence. Prior to Cadence she held positions as a system on chip (SoC) thermal engineer at Qualcomm for nine years and thermal engineer at Broadcom for two years. Dr. Roshandell earned her BS in mechanical engineering at the University of California, San Diego, and her MS and PhD in mechanical engineering at the University of California, Irvine.

Karthick Gopalakrishnan is a product engineer at Cadence supporting the Celsius line of electrothermal analysis products. Prior to joining Cadence, he was a thermal/CFD application engineer at Mentor Graphics. Karthick holds an MS in mechanical engineering from the North Carolina State University, where he specialized in thermal and fluid sciences.