Proactively Address Thermal Concerns in Advanced IC Packages

The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find that IC packages may overheat if they do not carefully plan for heat dissipation.

This webinar will show how design teams that implement thermal mitigation strategies early in the design cycle are facing fewer thermal concerns with their IC package prototypes.  We will walk through a reference design and discuss how Cadence Advanced Package Designer Plus combined with Celsius Thermal Solver address feasibility during the design planning stage to the full-system final signoff.

Join our webinar to learn how you can:

• Efficiently address thermal concerns throughout the design cycle
• Reduce design iterations
• Proactively drive predictability into your design schedules