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IMAPS Device Packaging
We-Ko-Pa Resort & Conference Center 10438 Wekopa Way, Fort McDowellThe 18th Annual Device Packaging Conference (DPC 2022) will be held at the WeKoPa Resort and Conference Center, from March 7-10, 2022. It is an international event organized by the International Microelectronics Assembly and Packaging Society…
CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform
Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA, and inter-die physical verification, which…
Connect Your System Architecture Design and Implementation
Join Cadence Training and Senior Application Engineer Dave Palumbo for this free technical Training Webinar. The disconnect between system architecture design and implementation makes creating a system that meets cost,…