Cadence
Conformal User Group Conference 2023 and Technology Day
Cadence Design Systems, Bldg 10 2655 Seeley Avenue, San Jose, CA, United StatesIt’s time for our inaugural CadenceCONNECT: Conformal® User Group Conference and Technology Day held on December 5th at the Cadence San Jose campus. This interactive, in-depth technical conference connects designers, verification engineers, and engineering managers to share the latest design and verification practices based on Cadence’s Conformal family of solutions including logical equivalence checking (LEC), low power… Conformal User Group Conference 2023 and Technology Day
Rigid Flex PCB In-Design Electromagnetic Analysis Workflow
Today's electronic products increasingly use Rigid-Flex PCBs to compress form factors, reduce weight, and increase cost-effectiveness. For many commercially available 3D numerical solver technologies (FEM and FDTD), the electromagnetic (EM) analysis of rigid-flex PCBs has always been challenging due to the complexity of the 3D designs. Much of this complexity comes from bending the board into… Rigid Flex PCB In-Design Electromagnetic Analysis Workflow
RTL-to-GDSII Flow for ASIC Design Using Cadence Tools
Would you like to know how to design a complete chip using the RTL-to-GDSII Flow? In this free technical Training Webinar with Application Engineer Sai Srinivas Pamula, we’ll teach you the essential steps in the RTL-to-GDSII design flow using a wide variety of industry-leading Cadence tools—such as the Xcelium Logic Simulator, Modus DFT Software Solution,… RTL-to-GDSII Flow for ASIC Design Using Cadence Tools
VLSID 2024
ITC Royal Bengal Kolkata, IndiaThe 37th International Conference on VLSI Design & the 23rd International Conference on Embedded Systems (VLSID 2024) are being held at Kolkata, India, during January 6-10, 2024. VLSID 2024 is returning to the city after 8 years since 2016. This flagship conference is bringing worldwide industry leaders, Indian and international industry bodies, and academic researchers in a… VLSID 2024
CES 2024
Las Vegas Covention and World Trade Center 3150 Paradise Rd, Las Vegas, NV, United StatesRegistration is now open for CES® 2024 — taking place Jan. 9-12, in Las Vegas. Flip the switch on global business opportunity with CES, where you can meet with partners, customers, media, investors, and policymakers from across the industry and the world all in one place. Don't miss your chance to be a part of the most powerful tech… CES 2024
Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis
The heterogeneous integration of chips/chiplets has added significant complexity to the IC package design process, further compressing schedules for many design teams. Design teams must work more efficiently to meet quality and performance goals while maintaining schedule milestones. One way to improve efficiency is to shift signal and power integrity (SI/PI) analysis to earlier in… Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis
ASP-DAC 2024
Incheon Songdo Convensia 123 Central Street, Yeonsu-gu, Incheon, Korea, Democratic People's Republic ofASP-DAC 2024 is the 29th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design, CAD and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances… ASP-DAC 2024
Verisium SimAI: Coverage Gaps Meet Their Match
Every project has some areas that seem impossible to cover. Various factors can cause these nearly impossible-to-hit coverage gaps, including technical complexity, lack of resources, and shifting requirements. In constrained random environments, simply running more random seeds may not always address these coverage gaps effectively. Overcoming these gaps requires creativity, persistence, and technical expertise. A… Verisium SimAI: Coverage Gaps Meet Their Match
Automotive World 2024
Tokyo Big Sight 3 Choe-11-1 Ariake, Tokyo, JapanCombination of exhibitions & conferences covering important topics in the automotive industry such as automotive electronics, connected car, autonomous driving, EV/HV/FCV, lightweight, processing technology and MaaS. Automotive OEMs and Tier 1 suppliers visit the exhibition to find suppliers and partners. 1,650 Exhibitors 85,000 Visitors 170 Speakers
Introducing OrCAD X, Our Next-Generation PCB Layout Solution
Whether you’re a beginner or a seasoned engineer, this webinar is a must-watch for anyone in the electronic design space. Join us to discuss how you can accelerate your PCB design process with our new and improved OrCAD X layout environment. Learn how you can: Design with an intuitive UI Collaborate using design review and markup… Introducing OrCAD X, Our Next-Generation PCB Layout Solution
Validating Clarity 3D Solver Accuracy Through Measurement Correlation
Cadence’s Clarity 3D Solver is an industry-leading EM simulation platform used by hundreds of design teams to address signal and power integrity (SI/PI) challenges. By solving bigger problems on more efficient compute resources, Clarity 3D Solver users have reimagined what can be done with 3D finite element method (FEM) solver technology. However, EM extraction results to… Validating Clarity 3D Solver Accuracy Through Measurement Correlation
DesignCon 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. 40 Under 40 Calling all Emerging Engineers and Leaders! DesignCon’s 40 Under 40 program launches in 2024 and provides… DesignCon 2024