chiplets
TSMC 2022 EU OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design enablement technologies and solutions targeting HPC and mobile applications Updated design solutions for specialty technologies enabling ultra-low voltage, analog migration,… TSMC 2022 EU OIP Ecosystem Forum
The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16 at 9:00 a.m. PST for an informative webinar on The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions… The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging
Introduction to UCIe
UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration. The newly formed UCIe Consortium fosters an open chiplet ecosystem by offering high-bandwidth, low-latency, power-efficient, and cost-effective on-package connectivity between… Introduction to UCIe
Proactively Address Thermal Concerns in Advanced IC Packages
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find that IC packages may overheat if they do not carefully plan for heat dissipation. This webinar will show how design… Proactively Address Thermal Concerns in Advanced IC Packages
The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build "software-defined solutions" that are differentiated in their respective markets. Sign up and save your spot for this special presentation. Overview With the advent of 3D ICs and heterogeneous semiconductor integration, mapping a system on a customized chip/hardware is accessible to "everyone.”… The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
Chiplets: Building the Future of SoCs
Chiplets, also known as heterogeneous multi-die systems, are increasingly seen as the future of System on Chips (SoCs). They offer a solution to meet the growing demands of high-performance computing in various industries, particularly fueled by the widespread adoption of AI technology. However, while the concept of using chiplets to construct larger chips to overcome… Chiplets: Building the Future of SoCs
Accelerating SoC Automotive Design with Chiplets
Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover how Cadence is empowering customers to achieve unparalleled success with chiplets. Here's what you can look forward to: Mastering Chiplet Architecture: Dive into the intricacies of mastering chiplet architecture, where… Accelerating SoC Automotive Design with Chiplets
Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets at the first package level in combination with advanced 2.5 and 3D packaging technologies. The chiplet approach has the advantage… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
GSA Mena Executive Summit
Grand Egypian Museum Alexandria Desert Rd, Kafr Nassar, Al Haram, Giza Governorate, Cairo, EgyptOn February 20, 2025 in Cairo, Egypt, we are hosting the GSA MENA Executive Summit to look beyond the current divisions and rather recognize the Middle East North Africa regional potential as a source of capital and destination for innovative tech developments. This semiconductor and tech-focused exec forum will take place in a stunning brand-new venue: the Grand… GSA Mena Executive Summit