EM/IR
Tackling Advanced Analog FinFET Back-End Design Challenges
The layout implementation of analog circuits in advanced FinFET technologies is becoming increasingly complex and challenging, with many new design rules to consider and multi-patterning, density rules, matching, and EM-IR concerns. These challenges can translate to longer layout turnaround times and reduced productivity. Join this CadenceTECHTALK to learn about silicon-proven technologies that improve layout engineering… Read More »Tackling Advanced Analog FinFET Back-End Design Challenges
How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges
As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop analysis crucial in addressing the performance and capacity challenges of such designs. Join… Read More »How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges