How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges

As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also temperature-dependent, making dynamic and static IR drop analysis crucial in addressing the performance and capacity challenges of such designs.

Join us to discover the challenges of PCB designs today and learn more about thermal only versus dynamic IR drop analysis. We will also demonstrate the Cadence® Celsius™ Thermal Solver’s ability to perform both static and dynamic IR drop analyses.

For questions and inquiries, or issues with registration, send an email to events@cadence.com