Intel
Chiplets: Building the Future of SoCs
Chiplets, also known as heterogeneous multi-die systems, are increasingly seen as the future of System on Chips (SoCs). They offer a solution to meet the growing demands of high-performance computing in various industries, particularly fueled by the widespread adoption of AI technology. However, while the concept of using chiplets to construct larger chips to overcome… Chiplets: Building the Future of SoCs
Hot Chips 2024
Memorial Auditorium 551 Jane Stanford Way, Stanford, CA, United StatesHot Chips 2024 will be held as a hybrid conference with in-person attendance at Memorial Auditorium, Stanford University from August 25 to 27, 2024. Conference Format Hot Chips 2024 is a hybrid conference. You may register to attend Virtually or In-Person. The In-Person conference is held at Memorial Auditorium, Stanford University. Tutorials: Sunday, August 25… Hot Chips 2024
Q3 Memory Fabric Forum
Memory fabrics unlock the power to pool, tier, and share memory in a data center fabric. The results will be vastly more memory capacity and lower cost due to higher utilization—the things needed to support memory-hungry generative AI apps. Attend this webinar for a comprehensive update on CXL® market adoption, technology, products, and use… Q3 Memory Fabric Forum
AI Hardware & Edge AI Summit 2024
Signia by Hilton 170 S Market Street, San Jose, CA, United StatesThe AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem, with a collaborative mission to train, deploy and scale machine learning systems that are fast, affordable, and efficient. Whether it’s forging new partnerships, staying ahead of the ever-changing semi-conductor landscape, learning how to build, train, and deploy efficient systems,… AI Hardware & Edge AI Summit 2024
TSMC North America OIP Ecosystem Forum 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… TSMC North America OIP Ecosystem Forum 2024
GSA U.S. Executive Forum 2024
Rosewood Sand Hill 2825 Sand Hill Road, Menlo Park, CA, United StatesTHE JOURNEY TO A $1T GLOBAL INDUSTRY The GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex environment where global forces intersect with regional dynamics. Industry executives will explore the delicate balance between globalization and regionalization, considering both opportunities and challenges while… GSA U.S. Executive Forum 2024
Electronic Design Process Symposium (EDPS) – 2024
SEMI 673 S. Milpitas Blvd, Milpitas, CA, United StatesEDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is now open: https://2024-ieee-edps.eventbrite.com. Who needs to register? Please see the Registration page. Talks from EDPS 2023 and the last 24 years of EDPS, are are available and… Electronic Design Process Symposium (EDPS) – 2024
2024 OCP Global Summit
San Jose Convention Center 150 W San Carlos Street, San Jose, CA, United StatesThe OCP Summit is the premier event uniting the most forward-thinking minds in open IT Ecosystem development. The Summit presents a unique platform for our Community from around the globe to share their insights, foster partnerships and showcase cutting-edge advancements in open hardware and software. The 2024 OCP Global Summit theme is "From Ideas to Impact". This… 2024 OCP Global Summit
IEEE World Technology Summit – AI INFRASTRUCTURE
San Jose Convention Center 150 W San Carlos Street, San Jose, CA, United StatesThis event features top executives from around the world who describe the burning issues surrounding AI and how to solve our immediate problems, focusing on these core areas: AI applications and their required infrastructure Silicon to support AI applications Systems to support AI applications Security and Standards AI is critical to our future. Please join… IEEE World Technology Summit – AI INFRASTRUCTURE
Ansys IDEAS User Conference India 2024
Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies. Overview At this… Ansys IDEAS User Conference India 2024
70th Annual IEEE International Electron Devices Meeting – IEDM 2024
Hilton San Francisco Union Square 333 O'Farrell Street, San Francisco, United StatesIEEE International Electron Devices Meeting (IEDM) is the world’s preeminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology, advanced memory, displays, sensors, MEMS devices, novel quantum and nano-scale devices and phenomenology, optoelectronics, devices for… 70th Annual IEEE International Electron Devices Meeting – IEDM 2024
PDF Solutions – AI Executive Conference
St. Regist Hotel 125 3rd Street, San Francisco, CA, United StatesThis one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI / ML solutions across the global semiconductor industry. Speakers from: ADI, Advantest, Cerebras, Intel, Microsoft, SAP, Siemens, TEL, Teradyne, Voltai, Yurts and… PDF Solutions – AI Executive Conference