Intel
The 31st IEEE International Symposium On Field-Programmable Custom Computing Machines
Marina del Rey Marriott 4100 Admiralty Way, Marina Del Rey, CA, United StatesThe IEEE Symposium on Field-Programmable Custom Computing Machines is the original and premier forum for presenting and discussing new research related to computing that exploits the unique features and capabilities of FPGAs and other reconfigurable hardware. Over the past two decades, FCCM has been the place to present papers on architectures, tools, and programming models… Read More »The 31st IEEE International Symposium On Field-Programmable Custom Computing Machines
ITF World 2023
Flanders Meeting & Convention Center Antwerp Antwerp, BelgiumImec’s flagship event on semiconductor advances & deep-tech solutions formerly known as Future Summits. Semiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. For many decades, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress… Read More »ITF World 2023
Embedded Vision Summit 2023
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesThe Summit attracts a global audience of technology professionals from companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile applications. Why attend? It's a First-Rate Program with Powerful Insights into Practical Perceptual AI. Join us for four days of learning—from tutorials to deep-dive days, covering the latest technical insights,… Read More »Embedded Vision Summit 2023
STAC Summit
New York Marriott Marquis 1535 Broadway, New York City, NY, United StatesSTAC Summits bring together CTOs and other industry leaders responsible for solution architecture, infrastructure engineering, application development, machine learning/deep learning engineering, data engineering, and operational intelligence to discuss important technical challenges in trading and investment.
3D-IC Foundry Frameworks
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks. About this Webinar Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower… Read More »3D-IC Foundry Frameworks
UCIe: On-Package Chiplet Innovation Opportunities
High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc. On-package interconnects are a critical component to deliver the power-efficient performance for this evolving landscape. Universal Chiplet Interconnect Express (UCIe), is an open industry standard with a fully specified stack… Read More »UCIe: On-Package Chiplet Innovation Opportunities
ERI 2.0 Summit
Hyatt Regency Seattle 805 Howell Street, Seattle, WA, United StatesWatch as leaders from our government agencies, the Defense Industrial Base, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry, national and economic security, and future research directions. The Electronics Resurgence Initiative (ERI), DARPA’s response to national-level microelectronics concerns, is designed to ensure U.S. leadership in cross-functional, next-generation microelectronics research, development,… Read More »ERI 2.0 Summit
Hot Chips 2023
Stanford University 471 Lagunita Drive, Stanford, CA, United StatesHot Chips 2023 (advance program) will be held as a hybrid conference with in-person attendance at Stanford University from August 27 to 29, 2023. Conference Format Hot Chips 2023 will be a hybrid conference. You may register to attend virtual or in-person. The conference venue is the Dinkelspiel Auditorium on the Stanford University Conference. Sunday… Read More »Hot Chips 2023
Accelerating Mainstream Adoption of Multi-Die Systems
Synopsys recently hosted a panel discussion with Ansys, Bosch, Intel, and Samsung to share their insights on the rapid adoption of multi-die systems. We invite you to the public broadcast of the panel where each company shares their view on the groundbreaking technology, what challenges lie ahead, and how companies can realize the promise of… Read More »Accelerating Mainstream Adoption of Multi-Die Systems
FPGAworld Conference 2023 – Stockholm
ÅF Frösundaleden 2A, 169 70 Solna, SwedenThe FPGAworld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational & industrial cases, and more. Registration for attendees is free and includes 2*coffee, lunch and go-home drink. Keynote Speaker Copenhagen and Stockholm 2023 Keynote speaker: Martin Kellermann , Microchip… Read More »FPGAworld Conference 2023 – Stockholm
SystemC Evolution Fika
The SystemC Evolution Fika is a series of online workshops to discuss the latest SystemC developments and applications. We refer to these workshops as fikas, to honor the fika tradition of sharing a coffee, slowing down a bit, and talking about things that we care about. Event information Date: 12 September 2023 Time: 16:00 - 18:00 CEST Location:… Read More »SystemC Evolution Fika
FPGAworld Conference 2023 – Copenhagen
DTU Science Park 2800 Kongens, Lyngby, DenmarkThe FPGAworld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational & industrial cases, and more. Registration for attendees is free and includes 2*coffee, lunch and go-home drink.