Renesas
Events
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The 26262 Club – Technical Conference
Holiday Inn Munich - City Centre Hochstraße 3, Munich, GermanyMEET US AT THE 26262 CLUB TECHNICAL CONFERENCE THIS COMING DECEMBER 5, 2022 In this edition, the 26262 club continues the discussion on the anticipated third edition and the emerging role of ISO 26262 within the evolving standards ecosystem. We bring on stage key global players from WG8 alongside authors of the most prominent upcoming standards and share must-have insights from the global standardisation…
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ISSCC 2023
Marriott Marquis 780 Mission Street, San Francisco, CA, United StatesISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our…
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Automotive Ethernet Congress
Hilton Munich Airport Terminalstraße Mitte 20, 85356 München-Flughafen, Munich, GermanyThe ninth Automotive Ethernet Congress to be held on March 21 - 23, 2023 at the Hilton Munich Airport will look to address the following questions: Does the selected transmission technology support the transformation of the E/E architecture from hardware-based to software-centric? Does it offer the necessary flexibility and self-learning capability to be able to continuously…
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Verification Futures 2023 UK
University of Reading Whiteknights Campus Park House, Reading, United KingdomThe Verification Futures conference provides a unique blend of conference presentations, exhibitions, training and industry networking sessions dedicated to discussing the challenges faced in hardware and software verification. Verification Futures provides a unique opportunity for end-users to define their current and future verification challenges and collaborate with the vendors to create solutions. It also provides…
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20th International Conference on IC Design and Technology (ICICDT)
University of Tokyo 7 Chome-3-1 Hongo, Tokyo, Japan2023 ICICDT is the twentieth edition (20th) in the series of the International Conference on IC Design and Technology, organized since 2004. 2023 ICICDT will be co-organized and held at the University of Tokyo, Tokyo, Japan from September 25-27, 2023. Design and technology co-optimization (DTCO) plays a critical role in the era of big data…
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Samsung Foundry Forum 2023 Tokyo, Japan
Belle Salle Tokyo Nihonbashi 2-7-1 Nihombashi, Chuo-ku, Tokyo, JapanWelcoming Remarks Seishu Arai VP, Head of Japan Office, Samsung Electronics Samsung Keynote Siyoung Choi President and GM, Foundry Business, Samsung Electronics Guest Speech I Junichiro Makino Professor, Kobe University Guest Speech II Sumiko Kanamori Automotive HPC, Analog & Power Solutions Gr. Digital Head of H/W Unit, VP, Renesas Electronics Corporation Guest Speech III Kazuoki…
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Verification Futures Conference 2024 UK
The Verification Futures conference provides a unique blend of conference presentations, exhibitions, training and industry networking sessions dedicated to discussing the challenges faced in hardware and software verification. Verification Futures provides a unique opportunity for end-users to define their current and future verification challenges and collaborate with the vendors to create solutions. It also provides…
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TSMC North America OIP Ecosystem Forum 2024
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design…
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2024 TSMC Europe OIP Ecosystem Forum
Hilton Amsterdam Airport Schiphol Schiphol Boulevard 701 Amsterdam, Amsterdam, NetherlandsLearn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design…
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38th International Conference on VLSI Design
The Leela Palace Bengaluru, IndiaInternational VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems, is attended by over 2000 engineers, students & faculty, industry, academia, researchers, bureaucrats and government bodies. VLSI Design Conference started…