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Power Devices SPICE Modeling for Si, GaN and SiC Technologies
Power Devices SPICE Modeling for Si, GaN and SiC Technologies
We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various approaches to the SPICE modeling of power devices, including compact models and macromodels. A significant portion of our presentation will be dedicated to the topic… Read More »Power Devices SPICE Modeling for Si, GaN and SiC Technologies