Tessent
Latest Past Events
Accelerating DFT verification sign-off with the Questa DFT Verification Platform
Siemens EDA 46871 Bayside Parkway, Building B, FremontAccelerating DFT verification sign-off with the Questa DFT Verification Platform This seminar will update you on technologies and techniques you can adopt to increase your DFT verification productivity today. Specifically, we will cover: Navigating the Growing Complexity of Design-for-Test and Evolving Verification Challenges Revolutionizing Test Strategies to deliver reliable products into HPC, Automotive, Aerospace,… Accelerating DFT verification sign-off with the Questa DFT Verification Platform
Smart methods for DFT chip architecture & validation
Combining market-leading design-for-test (DFT) technologies with best-in-class netlist synthesis allows you to achieve DFT success more quickly. Many customers, including those for emulation and IC test, have challenges with scaling architectures. This webinar describes how Siemens emulation and silicon test solutions can work together to provide a smart DFT plug-and-play architecture for Veloce ICs. The… Smart methods for DFT chip architecture & validation
DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D devices. In this webinar you will learn how to use Tessent Multi-die and still adhere to standards like IEEE 1149.1,… DFT for chiplets & 3D ICs using Tessent Multi-die