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AI/ML

Rambus, March 15, 2022

Memory Bandwidth Races Higher with HBM3

With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he… 

59th DAC

59th DAC

The Design Automation Conference (DAC) is the premier event devoted to the design and design automation of electronic systems and circuits. DAC focuses on the latest methodologies and technology advancements in electronic design. Get ready… 

Achronix, December 16, 2021

How to Overcome the Pain Points of AI/ML Hardware Design

Join Achronix for a live Webinar December 16th: 10-11 AM Pacific and Recorded On-Demand After the Event AI/ML hardware faces three common pain points: memory bandwidth, computational throughput and on-chip data movement. Next-generation FPGA technology…