Connecting the Synopsys User Community SNUG conferences have connected Synopsys global users for more than three decades. SNUG 2025 will once again provide a place where users and technical experts can meet, network, and share…
Previous years: 2023 2022 2021 2020 2019 2018 2017 2016 Happy holidays from all of us at Broadcom! Wherever you are in the world, we're wishing you a season of peace, joy, and connection. Here’s to a bright and connected 2025! pic.twitter.com/THNRGlErfS…
The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemmination of latest research in the areas of electrical design of…
The China Integrated Circuit Design Industry Exhibition (ICCAD-Expo) has always played an important role in promoting industrial agglomeration, connecting industrial resources, and mastering industry trends.
International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems,…
Electromagnetic Compatibility (EMC) simulation ensures that electronic devices comply with regulatory standards and perform optimally in their intended environments. As the complexity of electronic systems increases, the importance of EMC simulation grows, allowing engineers to…
Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry…
TGS offers a wonderful opportunity for networking, learning, and sharing the latest technology developments with our community, as well as meeting with Tower’s executives and team of experts. We invite you to join us! Time…
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric…
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early…