Register for this Cadence TECHTALK™ webinar, where senior director of solutions marketing Frank Schirrmeister will discuss how commercial electronics hardware companies use cutting-edge design techniques… Read More »Digital Engineering Best Practices for Aerospace & Defense
NAFEMS Americas will be hosting its biennial regional conference, formerly known as CAASE, on June 21-23, 2022, face-to-face, at the Indiana Convention Center in Indianapolis, Indiana! The NAFEMS… Read More »NAFEMS Americas Conference 2022
System designers face increasing challenges in meeting technical specifications and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continues to grow.… Read More »Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
A UVM testbench is a large and complex piece of software. At some stage, like any other large and complex piece of software, a verification… Read More »Debugging Features of UVM
As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package… Read More »How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges
Welcome to ITherm 2022 The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems May 31 – June 3, 2022 Sheraton Hotel & Marina San… Read More »ITherm 2022
The 6th PIC International conference will build on the success of its predecessors, with industry-leading insiders delivering more than 30 presentations spanning four sectors. Attendees… Read More »PIC International Conference
System designers face increasing challenges to meet technical specification and time-to-market requirements. While process nodes continue to shrink, the complexity of packages continue to grow.… Read More »Increase Efficiency and Reduce Risks with IC and Package Co-Design Flows
The Peripheral Component Interconnect Express (PCIe®) high-speed interface has become the standard for computer expansion cards due to its high bandwidth combined with manageable component… Read More »Conquer SI/PI Challenges and Reduce Time to Signoff for PCIe 6.0
The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends… Read More »European Test Symposium 2022