Synopsys recently hosted a panel discussion with Ansys, Bosch, Intel, and Samsung to share their insights on the rapid adoption of multi-die systems. We invite you to the public broadcast of the panel where each… Accelerating Mainstream Adoption of Multi-Die Systems
Chiplet-based SoC architectures have seen increased interest over the past three years, and recently were made a focus of the federal CHIPS and Science Act to reduce the cost of innovation for US-based semiconductor startups,… IP Lifecycle Management for Chiplet-Based SoCs
SEMICON Japan is the premier event that brings together the semiconductor manufacturing supply chain for the latest insights, trends and innovations as the industry powers digital transformation. SEMI Japan 2022 will highlight Smart applications powered… SEMICON Japan + Advanced Packaging and Chiplet Summit
The First Annual Chiplet Summit is the show chip designers can’t miss if they want to stay competitive. They’ll get the scoop on ways to make their chiplets run faster, scale better, use less power,… Chiplet Summit
Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA, and inter-die physical verification, which must be considered early during… CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform