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Chiplet

Keysight, November 14, 2023

Why Chiplets with UCIe are the Next Big Thing

Artificial intelligence (AI) and virtual reality (VR) require fast, efficient, low-power technologies. Transistors are becoming harder and harder to shrink, so chiplets are a promising alternative. Chiplets are small, modular… Read More »Why Chiplets with UCIe are the Next Big Thing

Cadence, Multi-Chiplet

CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform

Multi-chiplet design and packaging introduces extra design and analysis requirements like system planning, bump alignment, TSV and micro-bump insertion and extraction, electrothermal analysis, cross-die STA,… Read More »CadenceTECHTALK: Efficient Multi-Chiplet Design with Integrity 3D-IC Unified Platform