Interoperability Breakfast – Synposys
3D glasses to lighten us up TSMC and ST presenters Winner of 10th annual Tensing Norgay Interoperability Award: IEEE ISTO Overview For the past several years I’ve seen TSMC create the iPDK standard and seen…
DAC 2010
Library Technologies
Who Mehmet Cirit, Founder of Library Technologies History I first met Mehmet at Silicon Compilers in the 80’s and have kept in touch with him over the years. What New product – Chip Timer, speeds…
DAC Pavilion Panel – Hot and SPICEy: Users Review Different Flavors of SPICE and Fast SPICE
Our panel discussion on Tuesday afternoon was well attended, thanks to the lively discussion from our three panelists: Aaron Barker – Oracle, Broomfield, CO Pierluigi Daglio – STMicroelectronics, Agrate, Italy Jin-Qin Lu – Atheros Communications,…
Silicon Frontline: F3D – Fast 3D Extraction for IC Designs
WhoDermott Lynch, VP of Sales and Marketing Overview May of 2009 introduced Silicon Frontline as a full-chip 3D extraction company, more accurate than pattern-based extraction tools. Notes News – TSMC has adopted Silicon Frontline in their AMS…
DAC Panel Session in the Pavilion – All About SPICE
Hot and SPICEy: Users Review Different Flavors of SPICE and Fast SPICE Topic Area: Analog/Mixed-Signal/RF Design Tuesday, June 15, 2010 Time: 4:30 PM — 5:15 PM Location: Booth #694 Summary: Are you one of the…
Add Some SPICE to Your EDA Life
I’ll be moderating a panel session in the DAC Pavilion on Tuesday, June 15th starting at 4:30PM with real SPICE users from: Atheros Sun Microsystems STMicroelectronics My first idea was to have EDA vendors on…