dac2010

I’ll be moderating a panel session in the DAC Pavilion on Tuesday, June 15th starting at 4:30PM with real SPICE users from:

My first idea was to have EDA vendors on the panel, but then Dave Millman of Ciranova suggested that we use real SPICE users instead. I thought that was a brilliant idea.

What questions would you like to hear these SPICE users answer?

I’m thinking about the following for discussion:

We’re using the following SPICE tools:

  • SPICE (name)
  • FastSPICE (name)
  • Analog FastSPICE (name)
  • HDL + SPICE (name)
  • HDL + FastSPICE (name)

We do circuit simulations using:

  • Transient analysis
  • Frequency analysis
  • Monte Carlo analysis
  • Sensitivity analysis
  • Current
  • Power
  • Leakage
  • IR drop
  • Substrate noise
  • Coupling
  • Jitter
  • BER
  • Extracted parasitics

Our models are:

  • BSIM3
  • BSIM4
  • Other

The capacity of our circuit simulations are:

  • 10K transistors
  • 100K transistors
  • 1M transistors
  • 10M transistors
  • 100M transistors
  • 1B transistors

Our IC technology is:

  • CMOS
  • SOI
  • BiCMOS
  • Other
  • Supplied by Foundry
  • Our own fab
  • 22nm, 28nm, 34nm,  40nm, 45nm, 65nm, 90nm, 180nm

What’s most important for our simulations are:

  • Simulation speed, run times
  • Accuracy
  • Capacity
  • Mixed HDL and SPICE
  • Other

The EDA vendors have been very good at supporting:

a)

b)

c)

The EDA vendors really need to help us with:

A)

B)

C)

We choose our present SPICE tools because:

1)

2)

3)

Our SPICE tool flow is:

  • Best in class point tools
  • Integrated from one vendor
  • Has our own internal tools