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EM/IR

Cadence, June 15, 2022

How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges

As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package… Read More »How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges

Cadence, May 12, 2022

Tackling Advanced Analog FinFET Back-End Design Challenges

The layout implementation of analog circuits in advanced FinFET technologies is becoming increasingly complex and challenging, with many new design rules to consider and multi-patterning,… Read More »Tackling Advanced Analog FinFET Back-End Design Challenges

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