IR drop closure is becoming a major challenge for designers on advanced nodes. The number of violations at signoff has increased significantly, leading to longer turnaround time (TAT) or violations being waived. To solve this…
As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package structures is critical, especially because these resistive losses are also…
The layout implementation of analog circuits in advanced FinFET technologies is becoming increasingly complex and challenging, with many new design rules to consider and multi-patterning, density rules, matching, and EM-IR concerns. These challenges can translate…