AI-Driven EM-IR Design Closure
IR drop closure is becoming a major challenge for designers on advanced nodes. The number of violations at signoff has increased significantly, leading to longer… Read More »AI-Driven EM-IR Design Closure
EM/IR
How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges
As boards become smaller and faster, the environment for thermal issues becomes increasingly challenging. The thermal management of significant resistive losses in PCB and package… Read More »How Static and Dynamic IR Drop Analysis Can Help PCB Designs Challenges
Tackling Advanced Analog FinFET Back-End Design Challenges
The layout implementation of analog circuits in advanced FinFET technologies is becoming increasingly complex and challenging, with many new design rules to consider and multi-patterning,… Read More »Tackling Advanced Analog FinFET Back-End Design Challenges