IESA AI Summit
Experience the unprecedented growth opportunities in the semiconductor and electronics industry, fueled by rapid advancements in Artificial Intelligence (AI). Embrace the paradigm shift from software-centric… Read More »IESA AI Summit
Intel
Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems
Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and… Read More »Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems
Innovative Designs Enabled by Ansys Solutions – IDEAS 2023
ANSYS’ VIRTUAL USER CONFERENCE FOR ELECTRONICS, SEMICONDUCTORS AND PHOTONICS DESIGNERS Join us for the IDEAS Digital Forum — a place to catch up on industry… Read More »Innovative Designs Enabled by Ansys Solutions – IDEAS 2023
The UCIe™ 1.1 Specification: Future Applications of Chiplets
Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel The UCIe™ (Universal Chiplet Interconnect… Read More »The UCIe™ 1.1 Specification: Future Applications of Chiplets
EDPS 2023
EDPS 2023 is approaching fast! The program is firming up – please see the program page for a preliminary list of talks. REGISTRATION IS NOW OPEN.… Read More »EDPS 2023
FPGAworld Conference 2023 – Copenhagen
The FPGAworld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based… Read More »FPGAworld Conference 2023 – Copenhagen
Accelerating Mainstream Adoption of Multi-Die Systems
Synopsys recently hosted a panel discussion with Ansys, Bosch, Intel, and Samsung to share their insights on the rapid adoption of multi-die systems. We invite… Read More »Accelerating Mainstream Adoption of Multi-Die Systems
SystemC Evolution Fika
The SystemC Evolution Fika is a series of online workshops to discuss the latest SystemC developments and applications. We refer to these workshops as fikas, to… Read More »SystemC Evolution Fika
UCIe: On-Package Chiplet Innovation Opportunities
High-performance workloads demand on-package integration of heterogeneous processing units, on-package memory, and communication infrastructure to meet the demands of today’s data centers, autonomous vehicles, etc.… Read More »UCIe: On-Package Chiplet Innovation Opportunities
ERI 2.0 Summit
Watch as leaders from our government agencies, the Defense Industrial Base, and prestigious universities bring unique and indispensable perspectives on our domestic semiconductor industry, national… Read More »ERI 2.0 Summit