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Andes, November 14, 2023

Leverage Certified RISC-V IP to Craft ASIL ISO 26262 Grade Automotive Chips

As semiconductor industry leaders, Bosch, Infineon, Nordic Semiconductor, NXP, and Qualcomm collaborate to drive the acceleration of automotive RISC-V semiconductors, join us for an insightful webinar on how you too can unlock the full potential… 

Agnisys, August 3, 2023

An Introduction to Correct-by-Construction Golden Specification-based IP/SoC Development

This webinar explores front-end automation advances that encompass an innovative register information management system to capture hardware functionality and addressable register map in a single “executable” specification. Appropriate Audience: ● Architects/RTL Designers ● Verification Engineers… 

Ansys, June 22, 2023

Design and Analysis of Multi-Die & 3D-IC Systems

The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from TSMC, provide advantages by significantly… 

IC Mask Design, March 21, 2023

PG Pcells- A Correct by Construction Power and Ground Distribution Strategy

Proper Power Strategy for Layouts comes with several requisites that pose great difficulty and are hard to balance without compromising on one or more aspects. Power strategy adds difficulty to an already complex process of… 

MunEDA, April 11, 2023

Enhance Productivity with Machine Learning in the Analog Front-End Design Flow

Advanced semiconductor nanometer technology nodes, together with smart IC design applications enable today very complex and powerful systems for communication, automotive, data transmission, AI, IoT, medical, industry, energy harvesting, and many more. However, more aggressive…