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Aniah, July 9, 2024

How to Reduce Thousands of False Errors in 15 Minutes

Analyzing electrical errors across an IP or a SoC at top level, can be a painful and long process, often requiring extensive setup time and hundred of hours to distinguish real issues from false positives.… How to Reduce Thousands of False Errors in 15 Minutes

Andes Menta, April 2, 2024

RISC-V Instruction Set Architecture: Enhancing Computing Power

*Work email required for registration* Don’t miss out on this exclusive opportunity to stay ahead in the rapidly evolving landscape of chip design. Join us for an engaging discussion that promises to inspire and inform:… RISC-V Instruction Set Architecture: Enhancing Computing Power

Agnisys, December 7, 2023

Avoiding Metastability in Hardware Software Interface (HSI) using CDC Techniques

Various IP blocks within an SoC are often required to work in different clock domains in order to satisfy the power constraints. Clock domain crossing (CDC) challenges faced by design engineers include: – Speed and… Avoiding Metastability in Hardware Software Interface (HSI) using CDC Techniques

Andes, November 14, 2023

Leverage Certified RISC-V IP to Craft ASIL ISO 26262 Grade Automotive Chips

As semiconductor industry leaders, Bosch, Infineon, Nordic Semiconductor, NXP, and Qualcomm collaborate to drive the acceleration of automotive RISC-V semiconductors, join us for an insightful webinar on how you too can unlock the full potential… Leverage Certified RISC-V IP to Craft ASIL ISO 26262 Grade Automotive Chips

Agnisys, August 3, 2023

An Introduction to Correct-by-Construction Golden Specification-based IP/SoC Development

This webinar explores front-end automation advances that encompass an innovative register information management system to capture hardware functionality and addressable register map in a single “executable” specification. Appropriate Audience: ● Architects/RTL Designers ● Verification Engineers… An Introduction to Correct-by-Construction Golden Specification-based IP/SoC Development

Ansys, June 22, 2023

Design and Analysis of Multi-Die & 3D-IC Systems

The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from TSMC, provide advantages by significantly… Design and Analysis of Multi-Die & 3D-IC Systems

IC Mask Design, March 21, 2023

PG Pcells- A Correct by Construction Power and Ground Distribution Strategy

Proper Power Strategy for Layouts comes with several requisites that pose great difficulty and are hard to balance without compromising on one or more aspects. Power strategy adds difficulty to an already complex process of… PG Pcells- A Correct by Construction Power and Ground Distribution Strategy

yieldHUB, March 28, 2023

Maximizing yields through collaboration

Semiconductor companies have long recognized the importance of yield management and having the right support in place to maximize results. In this 30-minute webinar brought to you by yieldHUB and SemiWiki, attendees will learn about… Maximizing yields through collaboration

MunEDA, April 11, 2023

Enhance Productivity with Machine Learning in the Analog Front-End Design Flow

Advanced semiconductor nanometer technology nodes, together with smart IC design applications enable today very complex and powerful systems for communication, automotive, data transmission, AI, IoT, medical, industry, energy harvesting, and many more. However, more aggressive… Enhance Productivity with Machine Learning in the Analog Front-End Design Flow

Planorama Design, April 25, 2023

The ROI of User Experience Design: Increase Sales and Minimize Costs

In today’s competitive landscape for IoT, edge, and cloud solutions, User Experience (UX) design has become more crucial than ever in achieving customer and business goals. During this live webinar, we will explore how UX… The ROI of User Experience Design: Increase Sales and Minimize Costs