A worldwide connected Event !! IP-SoC 2024 will be the 27th edition of the working conference fully dedicated to IP (Silicon Intellectual Property) and IP based electronic systems. The event is the annual opportunity for IP… IP-SoC Conference 2024, Europe
Join us in person at the Synopsys TCAD Winter Reception on December 10, 2024. You have a chance to meet with our executives and product experts to learn about the latest insights on how Synopsys… Synopsys TCAD Winter Reception
Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry… Ansys IDEAS User Conference India 2024
TGS offers a wonderful opportunity for networking, learning, and sharing the latest technology developments with our community, as well as meeting with Tower’s executives and team of experts. We invite you to join us! Time… Tower Semiconductor – Technical Global Symposium 2024
This event covers the challenges in ensuring an FPGA is secure and demonstrably safe as per the relevant industry safety standards. This includes supply chains, FPGA hardware and the IP used on the FPGA Agenda… FPGA Front Runner: FPGA Safety and Security
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric… 2024 TSMC Europe OIP Ecosystem Forum
This event features top executives from around the world who describe the burning issues surrounding AI and how to solve our immediate problems, focusing on these core areas: AI applications and their required infrastructure Silicon… IEEE World Technology Summit – AI INFRASTRUCTURE
The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early… Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design
The AI revolution and other application domains, like data centers, advanced wireless communications, image and video processing, automated driving assistance, and post-quantum cryptography need more powerful architectures with higher performance. This is driving demand for… ASIP University Day 2024: Domain-Specific Processor Design using ASIP Designer
