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Ansys-Synopsys, November 19, 2024

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early… 

Synopsys, November 13, 2024

ASIP University Day 2024: Domain-Specific Processor Design using ASIP Designer

The AI revolution and other application domains, like data centers, advanced wireless communications, image and video processing, automated driving assistance, and post-quantum cryptography need more powerful architectures with higher performance. This is driving demand for…