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Ansys, November 20, 2024

Ansys IDEAS User Conference India 2024

Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry… Ansys IDEAS User Conference India 2024

Tower, November 20, 2024

Tower Semiconductor – Technical Global Symposium 2024

TGS offers a wonderful opportunity for networking, learning, and sharing the latest technology developments with our community, as well as meeting with Tower’s executives and team of experts. We invite you to join us! Time… Tower Semiconductor – Technical Global Symposium 2024

Tessolve, 21 November 2024

FPGA Front Runner: FPGA Safety and Security

This event covers the challenges in ensuring an FPGA is secure and demonstrably safe as per the relevant industry safety standards. This includes supply chains, FPGA hardware and the IP used on the FPGA Agenda… FPGA Front Runner: FPGA Safety and Security

TSMC, November 19, 2024

2024 TSMC Europe OIP Ecosystem Forum

Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric… 2024 TSMC Europe OIP Ecosystem Forum

WTS, November 12-14, 2024

IEEE World Technology Summit – AI INFRASTRUCTURE

This event features top executives from around the world who describe the burning issues surrounding AI and how to solve our immediate problems, focusing on these core areas: AI applications and their required infrastructure Silicon… IEEE World Technology Summit – AI INFRASTRUCTURE

Ansys-Synopsys, November 19, 2024

Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early… Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design

Synopsys, November 13, 2024

ASIP University Day 2024: Domain-Specific Processor Design using ASIP Designer

The AI revolution and other application domains, like data centers, advanced wireless communications, image and video processing, automated driving assistance, and post-quantum cryptography need more powerful architectures with higher performance. This is driving demand for… ASIP University Day 2024: Domain-Specific Processor Design using ASIP Designer

ITC 2024

ITC 2024

International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back… ITC 2024