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THE FUTURE OF MORE THAN MOORE—Chiplets, Advanced Packaging, and More

November 3 @ 8:00 am - 11:30 am PDT

SEMI, November 3, 2022

Presented by the SEMI
Pacific Northwest and Silicon Valley Chapters

How can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology, economics, and new opportunities in the semiconductor supply chain.

Join us at the Forum on Thursday, November 3, 2022, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person, Virtual, and On-Demand for your convenience.

Speakers

ASE
Mark Gerber
Sr. Director, Engineering & Technical Marketing

Advanced Packaging: Enabling a New Generation of Silicon Systems

FORMFACTOR

Amy Leong
SVP, CMO, GM Emerging Growth/M&A

Strategy for Wafer Probe in a Chiplet World

GARTNER

Bob Johnson
Vice President,
Analyst

Semiconductor Market Outlook: Change in the Midst of Uncertainty

GOOGLE
Martin Dixon
Director of
Engineering

[KEYNOTE] Open Chiplets to Enable a New Era of Silicon

INTEL CORPORATION

Martha Dudek, PhD
Sr. Director, Assembly Materials Global Supply Chain

[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging

Details

Date:
November 3
Time:
8:00 am - 11:30 am PDT
Event Categories:
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Event Tags:
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Website:
Event Website

Organizer

SEMI
View Organizer Website

Venue

Biamp Systems
9300 SW Gemini Dr.
Beaverton, OR United States
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