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THE FUTURE OF MORE THAN MOORE—Chiplets, Advanced Packaging, and More
November 3 @ 8:00 am - 11:30 am PDT
Presented by the SEMI
Pacific Northwest and Silicon Valley Chapters
How can we extend Moore’s Law and drive new capabilities in the More than Moore era? The answer lies in the technology, economics, and new opportunities in the semiconductor supply chain.
Join us at the Forum on Thursday, November 3, 2022, 8–11:30am Pacific Time to hear industry experts explore the Future of More Than Moore. The event is In-Person, Virtual, and On-Demand for your convenience.
Sr. Director, Engineering & Technical Marketing
Advanced Packaging: Enabling a New Generation of Silicon Systems
SVP, CMO, GM Emerging Growth/M&A
Strategy for Wafer Probe in a Chiplet World
Semiconductor Market Outlook: Change in the Midst of Uncertainty
[KEYNOTE] Open Chiplets to Enable a New Era of Silicon
Martha Dudek, PhD
Sr. Director, Assembly Materials Global Supply Chain
[KEYNOTE] Material Supply Chain Innovations for Advanced Packaging