Design and Analysis of Multi-Die & 3D-IC Systems
The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from… Read More »Design and Analysis of Multi-Die & 3D-IC Systems
Verification Futures 2023 UK
University of Reading Whiteknights Campus Park House, ReadingThe Verification Futures conference provides a unique blend of conference presentations, exhibitions, training and industry networking sessions dedicated to discussing the challenges faced in hardware and software verification. Verification Futures… Read More »Verification Futures 2023 UK
DVCon Japan 2023
Kawasaki CIty Industrial Promotion Hall Kawasaki CityThe Design & Verification Conference & Exhibition is the premier conference on the application of languages, tools, methodologies and standards for the design and verification of electronic systems and integrated… Read More »DVCon Japan 2023
How AI and Semiconductors Will Drive Innovation and Productivity
Semiconductors are critical to the functioning of the modern world driving economic competitiveness, national security, and technologies ranging from modern defense capabilities to autonomous vehicles. Artificial Intelligence and the hardware… Read More »How AI and Semiconductors Will Drive Innovation and Productivity