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DFT for chiplets & 3D ICs using Tessent Multi-die
3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after… Read More »DFT for chiplets & 3D ICs using Tessent Multi-die
CXL DevCon 2024
Santa Clara Marriott 2700 Mission College Blvd, Santa ClaraThe CXL Consortium is looking forward to hosting the first Compute Express Link® (CXL®) DevCon from April 30 – May 1, 2024, in Santa Clara, California! CXL DevCon is a… Read More »CXL DevCon 2024