• Latch-Up 2024: Boston

    Massachusetts Institute of Technology 77 Massachusetts Avenue, Boston, MA, United States

    Friday to Sunday April 19–21, 2024 in Boston, MA, USA The Latch-Up conference is a weekend of presentations and networking dedicated to free and open source silicon. It's an event for the open source digital design community, much like its European sister conference ORConf, run by the FOSSi Foundation. You are all invited! The FOSSi… 

  • CICC 2024

    DoubleTree by Hilton Denver 3203 Quebec Street, Denver, CO, United States

    The IEEE Custom Integrated Circuits Conference is a premier conference devoted to IC development. The conference program is a blend of oral presentations, exhibits, panels and forums. The conference sessions present original first published technical work and innovative circuit techniques that tackle practical problems. CICC is the conference to find out how to solve design… 

  • Siemens User2User Verification Forum 2024 India

    Hyatt Place, Banjara Hills Road no 1, Banjara Hills, Hyderabad, India

    Join us at the Siemens User2User Verification Forum 2024 in India next week! Gain insights on Smart Verification - Using AI in Functional Verification and learn best practices in design and verification flows that can speed up your ASIC and FPGA design & verification cycle. Don't miss the chance to leverage AI and ML based… 

  • osmosis Aerospace and Defense 2024 A Formal Verification Virtual Event

    osmosis Aerospace and Defense (A&D) is about sharing the success in using formal techniques to address the demanding verification requirements and challenges of DO-254 compliant and other high-consequence systems. ‌ We have put together the following program covering a wide range of formal verification topics. Day 1 - Tuesday, April 23 10:00am Pacific | 1:00pm… 

  • DVClub Europe – Formal Verification

    13 days to go the next DVClub Europe meeting takes place on Tuesday 23rd April with a theme of "Formal Verification". Formal Verification can help you find bugs earlier in the design cycle and accelerate root cause analysis. But success with Formal requires the effective selection and implementation of the right formal technologies and methods. In this DVClub meeting… 

  • Deploying Solido Design Environment AI Workflows on AWS

    Utilizing AWS cloud resources to accelerate variation-aware verification   AI-powered Solido Design Environment provides SPICE-accurate variation-aware verification for 3, 4, 5, 6 and higher sigma targets, orders of magnitude faster than traditional brute-force methods. With cloud computing made more accessible than before, many teams are considering running design and verification workloads, including Solido Design Environment, on… 

  • The Era of Software-Defined Everything: Chiplets and Bespoke Silicon

    From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build "software-defined solutions" that are differentiated in their respective markets. Sign up and save your spot for this special presentation. Overview With the advent of 3D ICs and heterogeneous semiconductor integration, mapping a system on a customized chip/hardware is accessible to "everyone.”… 

  • Siemens User2User Verification Forum 2024 India

    Hotel Radission Blu, Marathalli ORR 90/4 Outer Ring Road, Bengaluru, India

    Join us at the Siemens User2User Verification Forum 2024 in India next week! Gain insights on Smart Verification - Using AI in Functional Verification and learn best practices in design and verification flows that can speed up your ASIC and FPGA design & verification cycle. Don't miss the chance to leverage AI and ML based… 

  • Improving Semiconductor Wafer Fabrication Process Efficiencies Using Ansys Solutions

    Ansys Semiconductor Manufacturing Webinar Series: Part 1 of 3. Join us on Thursday, April 25th for an in-depth view of multi-physics simulation in the semiconductor fabrication process. Overview Accurate design and optimization of the semiconductor fabrication process/equipment for yield improvements and faster time-to-market require multiphysics simulation, which can address various physical interactions and phenomena. By… 

  • Tech Summit: ASC Sunstone & Screaming Circuits

    Holiday Inn Portland - Columbia Riverfront 909 North Hayden Island Drive, Portland, OR, United States

    Calling all PCB designers and engineers to join us for an exclusive Technical Summit and Casino Excursion for Designers & Engineers! This summit is crafted to bring together PCB engineers and technical professionals for a day of immersive learning, cutting-edge insights, and many networking opportunities. Join us to expand your knowledge, establish invaluable connections, and… 

  • DFT for chiplets & 3D ICs using Tessent Multi-die

    3D IC (2.5D/3D) designs are on the rise. Design for Test (DFT) for chiplets must be general purpose so they can be tested stand alone and easy to test after assembly into 2.5D or 3D devices. In this webinar you will learn how to use Tessent Multi-die and still adhere to standards like IEEE 1149.1,… 

  • TSMC 2024 Technology Workshop – Austin

    JW Marriott Austin 110 E 2nd St, Austin, TX, United States

    08:30 – 09:30 Registration & Partner Pavilion 09:30 – 09:40 Welcome & Opening Remarks 09:40 – 10:00 Market Outlook – Powering AI Together 10:00 – 10:30 Advanced Technology Leadership 10:30 – 11:00 Coffee Break & Ecosystem Pavilion 11:00 – 11:25 Specialty Technology Leadership 11:25 – 11:50 Manufacturing Excellence 11:50 – 13:00 Lunch & Ecosystem Pavilion…