Webinar
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Functional Verification workflow for Trusted and Assured Microelectronics
Functional Verification workflow for Trusted and Assured Microelectronics
In a world of increasing trust and assurance challenges for microelectronic devices, emerging industry standards and defense policy demand early and advanced functional verification methods before ICs may be deployed in critical end products and systems. Questa technologies, built upon a foundation of world-class simulation and formal engines, provide the results desired for raising and meeting higher levels… Read More »Functional Verification workflow for Trusted and Assured Microelectronics
DVClub Europe: Verifying Safety in Automotive
DVClub Europe: Verifying Safety in Automotive
Hardware designs intended for the automotive domain need to implement safety mechanisms to minimize the risk of accidents and injuries caused by hardware-related issues in vehicles. In this DVClub we will cover how those safety mechanisms need to be verified to be compliant with ISO26262, the international standard covering automotive safety. Agenda (GMT) 12:00 Welcome… Read More »DVClub Europe: Verifying Safety in Automotive
1 event,
Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
Join us for this webinar on RF GaN amplifier design using electromagnetic/thermal 3D solvers. We will discuss the step-by-step process of building a GaN amplifier, beginning with the transistor model in the circuit simulator. The webinar will outline the steps required to convert this to a physical layout for electromagnetic simulation and verification while integrating… Read More »Design Exploration of RF GaN Amplifier, 3D Packaging, and Thermal Analysis
2 events,
Power Devices SPICE Modeling for Si, GaN and SiC Technologies
Power Devices SPICE Modeling for Si, GaN and SiC Technologies
We start by examining the different technologies used in the manufacturing of power devices, including Si, GaN, and SiC, considering their respective particularities and advantages. We will then analyze various approaches to the SPICE modeling of power devices, including compact models and macromodels. A significant portion of our presentation will be dedicated to the topic… Read More »Power Devices SPICE Modeling for Si, GaN and SiC Technologies
Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
Signal and power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density PCBs. Easy-to-use in-design analysis directly integrated into the Allegro PCB design environment uncovers SI/PI issues early in the design process, leading to faster signoff of designs. With analysis shifting left in the design cycle, design teams can achieve efficient signoff of… Read More »Seamless SI/PI Signoff of Allegro PCB Designs Driven by In-Design Analysis
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2 events,
Power Innovations in Consumer Electronics Using LF EM Solutions
Power Innovations in Consumer Electronics Using LF EM Solutions
This webinar will cover how the Ansys simulation tools are now widely used in many low-frequency (LF) EM applications, such as wireless charging, power supplies, transformers, magnetic latches and actuators, PCB/ECAD, and more. Discover how Ansys Maxwell enables rapid and accurate simulation of EM fields in electronic and consumer devices to reduce design iterations, component… Read More »Power Innovations in Consumer Electronics Using LF EM Solutions
Introducing Ansys AI: A New Chapter in Engineering Simulation
Introducing Ansys AI: A New Chapter in Engineering Simulation
Join us to learn more about the AI and Simulation Revolution in this upcoming webinar. We're revolutionizing engineering simulation with the power of Artificial Intelligence with SimAI, AnsysGPT, and Ansys AI+. Overview At Ansys, we are revolutionizing engineering simulation with the power of Artificial Intelligence. Our AI-augmented simulation technology is a game-changer, bringing unprecedented speed,… Read More »Introducing Ansys AI: A New Chapter in Engineering Simulation
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Essential Steps to Simplify VHDL Testbenches Using OSVVM
Essential Steps to Simplify VHDL Testbenches Using OSVVM
This “Getting Started” webinar focuses on the first, essential steps you need to take when looking to improve your VHDL testbench approach. In this webinar we examine transaction-based testing, self-checking tests, messaging, reports, and Open Source VHDL Verification Methodology (OSVVM) helper utilities. The “transaction” in transaction-based testing is just a fancy word for an… Read More »Essential Steps to Simplify VHDL Testbenches Using OSVVM
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SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies
SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies
The demand for Custom ICs is on the rise globally along with high proliferation of semiconductor content. Higher requirements on power, performance, area, and yield, as well as other factors such as advanced process nodes and mission-critical applications have increased the need for accurate verification across process, voltage, and temperature corners, as well as local… Read More »SPICE-accurate variation-aware verification best practices with Solido AI-powered technologies
1 event,
Comprehensive CXL 3.0 Verification Solution for High-Bandwidth and Low-Latency Connectivity
Comprehensive CXL 3.0 Verification Solution for High-Bandwidth and Low-Latency Connectivity
Join us for a deep dive into the most comprehensive CXL Verification IP solution available in the market that targets 1.1, 2.0 and 3.0, Siemens Avery CXL Verification IP. Compute Express Link (CXL) is an open industry-standard interconnect offering coherency and memory semantics using high- bandwidth, low-latency connectivity between host processor and devices such as… Read More »Comprehensive CXL 3.0 Verification Solution for High-Bandwidth and Low-Latency Connectivity
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From code to solution: tools and tactics for aerospace fault code troubleshooting
From code to solution: tools and tactics for aerospace fault code troubleshooting
Join us in this insightful webinar as we delve into the world of aerospace and defense electrical fault code troubleshooting, unveiling the power of Capital™ Service Explorer. Discover innovative strategies to diagnose issues swiftly, minimizing downtime and optimizing product performance. Explore real-world examples showcasing how Capital Service Explorer facilitates the identification of commonalities among multiple… Read More »From code to solution: tools and tactics for aerospace fault code troubleshooting
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Manufacturing driven design – DFM within an Xpedition Flow
Manufacturing driven design – DFM within an Xpedition Flow
We often think of Design for Manufacturing (DFM) as the sole responsibility of the fabricator. Over the years, many OEMs have implemented DFM as a final check in their release process, but that approach does not prevent issues within a design from piling up and being left for a DFM engineer to identify and communicate… Read More »Manufacturing driven design – DFM within an Xpedition Flow