Webinar
Events
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UCIe PHY Modeling and Simulation with XMODEL
Chiplets are emerging as a new way of building IC systems via heterogeneous integration, and Universal Chip Interconnect Express (UCIe) is one of the standards defining the interconnects among chiplets. This webinar presents the SystemVerilog models of a Universal Chiplet Interconnect Express (UCIe) interface, including both the analog circuits in the electrical layer and digital…
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Embedded UVM (eUVM)
This is to inform you that the next DVClub Europe meeting takes place on Tuesday 11th July with a theme of "Embedded UVM(eUVM)". Introduction to Embedded UVM to enable HPC-Powered UVM Testbenches with MultiCore Performance. Agenda (BST) 12:00 Welcome and Introduction - Mike Bartley, Senior Vice President - VLSI Design, Tessolve 12:00 Puneet Goel, Coverify Systems Technology LLP…
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An AI/ML Driven High-Level Synthesis Solution
High-Level Synthesis (HLS) tools yield better PPA when the "right set" of optimization constraints and tool settings are applied. Determining the right set of constraints and settings requires design and tool experience and exploration. AI/ML technology has proven highly effective at exploring the solution space and lowering the required tool expertise. This CadenceTECHTALK™ presents details on…
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Comprehensive Static Verification for FPGA and ASIC RTL Designers
As designs get increasingly complex, design teams are looking to find bugs earlier, to reduce rework and shorten time-to-market. The ultimate “shift left” is to put easy-to-use static verification in the hands of RTL designers to eliminate bugs at their source. This webinar covers comprehensive static verification capabilities in the Cadence® Jasper™ Superlint and CDC apps for…
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Key MAC Considerations for the Road to 1.6T Ethernet Success
224G SerDes designs are a reality and the path to 1.6T is clearer than ever. This webinar delves into the considerations, challenges and solutions designers need to know for the MAC required for these 224G Ethernet PHY IP designs. Dive deep into the nuances of PHY/MAC layer interactions, timing considerations, and forward error correction. We will…
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Automated Verification for Cache Coherent RISC-V SoCs
RISC-V SoC design complexity continues to increase and create new verification challenges. Private caches, shared caches, and shared main memory create potential caches/memory coherency problems that require modern, automated verification approaches. In this webinar, we’ll demonstrate how Perspec System Verifier, with the pre-defined System Traffic Library (STL), provides an out-of-the-box verification plan and test suite…
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Achieve Optimal PPA Targets Using AI-Driven Technology
Complexity brought on by advanced process nodes have opened the door to challenges in achieving optimal power, performance, and area (PPA). Manual methods are no longer viable given shrinking market windows. The need to drive for better results faster is increasing, and traditional methods cannot keep pace often taking months of tuning using 100s of…
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3D-IC Foundry Frameworks
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks. About this Webinar Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower…
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Achieve First-pass Silicon Leveraging SDC Verification Early with No Noise
As today’s designs are getting more complex, design constraints complexity also increases multifold. While ensuring design correctness typically gets a lot of attention including code review, functional verification, implementation, etc., correctness of constraints requires the same level of attention. Quality of implementation and timing analysis is highly dependent on quality of constraints. For achieving first-past…
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Solution for 3D-IC Interposer Signal Integrity
Our upcoming CadenceTECHTALK: Solution for 3D-IC Interposer Signal Integrity is designed to teach engineers to translate a GDSII stream format (GDSII) file and partition it into simulation blocks for the Clarity 3D field solver. First, you will learn to use GDS-supporting files to simplify GDS to SPD translation and reuse those files to make the…
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Solution for 3D-IC Interposer Signal Integrity
3D-IC design requires early analysis of thermal properties, power delivery, and signal integrity. This webinar will work through the process of simulating heterogeneously integrated chiplets. Learn about the integrated workflow that begins with silicon design data being accurately modeled with 3D FEM extraction. The Cadence Clarity 3D Solver has the unique ability to efficiently import…
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A Novel Approach to Implementing Logical ECOs with Synopsys Formality ECO on High Performance RISC-V Cores
RTL engineering change order (ECO) is vital to ensuring proper functionality of integrated circuits (ICs). Retiming and auto ungrouping optimize RTL implementation and enhance PPA. However, aggressive optimizations in CPU RTL designs present challenges due to increased design complexity and potential mapping issues. Synopsys Formality ECO offers an efficient and accurate solution for RTL ECO…