• Advancing Magnetic Memory Technology with Atomistic Modeling

    In this event, experts from Martin-Luther-Universitat Halle Wittenberg, University of York, and Synopsys QuantumATK will present how to use ab initio DFT modeling and atomistic spin dynamics simulations of MTJs to guide and accelerate the technological development of magnetic memory such as STT and SOT-MRAM. Investigating the potential of novel magnetic tunnel junction (MTJ) materials… 

  • Maximize Performance and Efficiency of Multi-die Data Center Chip Designs with Arm CoreLink CMN-700 and Synopsys Platform Architect

    This webinar will showcase the design, analysis, and optimization of a multi-die fabric architecture based on the next generation Arm® CoreLink™ CMN-700 interconnect, a high-performance cache coherent interconnect solution designed for complex multi-die system-on-chip (SoC), such as those found in data centers. Attendees will learn how to use the Arm CMN-700 Performance Model in Synopsys… 

  • How Deep Data Analytics Accelerates SoC Time-To-Market by 6 Months

    This webinar will cover how using deep data analytics: Accelerates time-to-market by 20-25% (equivalent to six months in this example), ensuring the product is first to market and able to capitalize on this advantage. Reduces design and development costs by nearly $25M, amounting to a 9% cost savings. Leads to a higher quality product by improving performance by… 

  • CadenceTECHTALK: System-Level Thermal Signoff from Chips Through to Racks

    Today’s modern electronic designs require ever more functionality and performance to meet consumer demand. These challenges become more critical and complex when resistive losses in PCB and package structures are significant since resistive losses are temperature dependent. In this webinar, we will look at an electrothermal co-simulation solution for the full hierarchy of electronic systems… 

  • The Path to 1.6TbE with 224G Ethernet PHY IP

    The need for faster and more efficient Ethernet solutions has never been greater, as the demands of high-performance computing and the rise of big data continue to grow. Join us as we explore the main challenges faced in scaling Ethernet to 1.6T and how the high-performance computing is changing the Ethernet landscape. In this webinar,… 

  • The Power of VHDL’s VHPI

    The programming interfaces of logic simulators are largely the domain of specialists writing proprietary tools and extensions and are only vaguely in the consciousness of many design and verification engineers, if aware at all. Yet the simplest use of such interfaces opens up a whole world of possibilities in extending what is achievable in verifying… 

  • Design Robust IC Packages Faster Using In-Design SI/PI Analysis

    IC package design teams and characterization teams have had a “throw-it-over-the-wall” relationship for decades, which often delays design releases by months. However, as signal integrity (SI) and power integrity (PI) challenges evolve with multi-die heterogeneous integration, the need to perform SI/PI analysis as part of the design flow has become a requirement to meet compressed… 

  • SemIsrael Tech Webinar

    Shine Chung Chairman Attopsemi Technology Revolutionary Metal I-fuse® OTP in FinFET Tech Umesh Sisodia CEO CircuitSutra Transforming Semiconductor Design Using SystemC Based Shift-left ESL Methodologies Roger Espasa CEO & FounderSemidynamics RISC-V, Out-of-Order IP Core, Vector Unit Siddharth Ravikumar Technical Product Manager, Solido IP ValidationSiemens EDA IP, QA, Validation, analog, digital, mixed-signal Michael Seaholm Product Manager… 

  • Basic Testbench for a Simple DUT

    Presenter: Espen Tallaksen, CEO of EmLogic Abstract Part 1: Functional simulation using an HDL testbench is the de facto method for proving functional correctness of FPGA designs. In this three-part webinar series we will present a step-by-step approach on how to architect a testbench - progressing from basic to advanced techniques. We will first use… 

  • Synopsys RF / mmWave IC Design Reference Flow with TSMC N6RF and N16FFC Process Nodes

    Wireless devices are ubiquitous, all requiring RF ICs to transmit and receive radio waves via antennas. The radio range can be a few meters for applications such as Bluetooth and WiFi to many kilometers for long range 5G, satellite and radar applications. Today's total RF market is growing rapidly with global RF IC sales exceeding… 

  • The Power of SystemVerilog’s DPI

    The programming interfaces of logic simulators are largely the domain of specialists writing proprietary tools and extensions and are only vaguely in the consciousness of many design and verification engineers, if aware at all. Yet the simplest use of such interfaces opens up a whole world of possibilities in extending what is achievable in verifying… 

  • Passive Component Synthesis and Optimization for IC Designs

    Join us at this webinar to learn more about the Cadence® EMX® Designer, our newly introduced passive component synthesis and optimization solution. In split seconds, the EMX Designer generates very flexible DRC-clean parametric cells of passive devices, such as inductors, transformers, and T-coils. Leveraging the EMX Planar 3D Solver, the industry’s gold-standard electromagnetic modeling engine,…