The 31st IEEE International Symposium On Field-Programmable Custom Computing Machines
Marina del Rey Marriott 4100 Admiralty Way, Marina Del Rey, CA, United StatesThe IEEE Symposium on Field-Programmable Custom Computing Machines is the original and premier forum for presenting and discussing new research related to computing that exploits the unique features and capabilities of FPGAs and other reconfigurable hardware. Over the past two decades, FCCM has been the place to present papers on architectures, tools, and programming models… Read More »The 31st IEEE International Symposium On Field-Programmable Custom Computing Machines
Advantest VOICE
Santa Clara Marriott 2700 Mission College Blvd, Santa Clara, CA, United StatesVOICE is a developer conference, created by test engineers for test engineers. Each year, the VOICE Developer Conference unites semiconductor test professionals representing the world's leading integrated device manufacturers (IDMs), foundries, fabless semiconductor companies and outsourced semiconductor assembly and test (OSAT) providers to exchange information about the latest technology advancements, express new ideas, share best… Read More »Advantest VOICE
Workshop on Open-Source Hardware, CF23-OSHW
Piazza San Giovanni in Mone, 1/2 Piazza San Giovanni in Monte, Bologna, ItalyCo-located with ACM International Conference on Computing Frontiers 2020 May 9 - May 11, 2023 - Bologna, Italy We are excited to announce a new workshop on the topic of open-source hardware, to be held concurrently with Computing Frontiers 2023. Aim and Scope The workshop aims to bring together researchers and practitioners working in the fields… Read More »Workshop on Open-Source Hardware, CF23-OSHW
TSMC – Boston Technology Workshop
Boston Marriott Burlington One Burlington Mall Road, Burlington, MA, United StatesJoin us and learn about: TSMC's smartphone, HPC, IoT, and automotive platform solutions TSMC's advanced technology progress on 5nm, 4nm, 3nm, 2nm processes and beyond TSMC's specialty technology breakthroughs on ultra-low power, RF, embedded memory, power management, sensor technologies, and more TSMC 3DFabric™ advanced packaging technology advancement on InFO, CoWoS®, and SoIC TSMC's manufacturing excellence,… Read More »TSMC – Boston Technology Workshop
Synopsys RF / mmWave IC Design Reference Flow with TSMC N6RF and N16FFC Process Nodes
Wireless devices are ubiquitous, all requiring RF ICs to transmit and receive radio waves via antennas. The radio range can be a few meters for applications such as Bluetooth and WiFi to many kilometers for long range 5G, satellite and radar applications. Today's total RF market is growing rapidly with global RF IC sales exceeding… Read More »Synopsys RF / mmWave IC Design Reference Flow with TSMC N6RF and N16FFC Process Nodes
User2User Europe 2023
Hilton Airport, Munich Terminalstraße Mitte 20, Munich, GermanyU2U is your opportunity to learn, grow and connect with fellow technical experts who design leading-edge products using Siemens EDA tools. U2U is focused on these areas: Design For Test & Embedded Analytics Electronic System Design/PCB Design analysis and manufacturing Functional Design & Verification Hardware Assisted Verification High Level Synthesis: Digital design in C++/SystemC IC… Read More »User2User Europe 2023
The Power of SystemVerilog’s DPI
The programming interfaces of logic simulators are largely the domain of specialists writing proprietary tools and extensions and are only vaguely in the consciousness of many design and verification engineers, if aware at all. Yet the simplest use of such interfaces opens up a whole world of possibilities in extending what is achievable in verifying… Read More »The Power of SystemVerilog’s DPI
ITF World 2023
Flanders Meeting & Convention Center Antwerp Antwerp, BelgiumImec’s flagship event on semiconductor advances & deep-tech solutions formerly known as Future Summits. Semiconductors have become increasingly instrumental – and often even dominant – for the future of industries and application domains worldwide. For many decades, imec has played a major role in the global semiconductor industry. Our expertise and partnerships now also progress… Read More »ITF World 2023
Experience the Future of Custom Design with Virtuoso Studio
Radisson Blu Outer King Road, Bengaluru, IndiaWith design boundaries constantly stretched and redefined, traditional borders for “custom design” no longer hold. Creative and intelligent solutions are imperative for boosting overall design, simulation, layout, and verification productivity through ever-changing specifications. Join us for this full-day in-person seminar to learn how Cadence is leveraging its expertise to revolutionize custom design on all fronts… Read More »Experience the Future of Custom Design with Virtuoso Studio
Passive Component Synthesis and Optimization for IC Designs
Join us at this webinar to learn more about the Cadence® EMX® Designer, our newly introduced passive component synthesis and optimization solution. In split seconds, the EMX Designer generates very flexible DRC-clean parametric cells of passive devices, such as inductors, transformers, and T-coils. Leveraging the EMX Planar 3D Solver, the industry’s gold-standard electromagnetic modeling engine,… Read More »Passive Component Synthesis and Optimization for IC Designs
MunEDA User Group 2023
Le Meridien No. 38, Songren Rd, Taipei, TaiwanWe are pleased to invite you to the MunEDA Users Group Meeting 2023. MUGM 2023 will take place on May 16th & 17th (Tue/Wed), 2023 in Munich, Germany. The goal of the event is an intensive exchange of knowledge by new and experienced industrial users. MUGM provides an open forum for engineers interested in MunEDA solutions… Read More »MunEDA User Group 2023
Power Integrity Issues and Solutions for Silicon Interposers
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation.… Read More »Power Integrity Issues and Solutions for Silicon Interposers