Achieve First-pass Silicon Leveraging SDC Verification Early with No Noise
As today’s designs are getting more complex, design constraints complexity also increases multifold. While ensuring design correctness typically gets a lot of attention including code review, functional verification, implementation, etc., correctness of constraints requires the same level of attention. Quality of implementation and timing analysis is highly dependent on quality of constraints. For achieving first-past… Read More »Achieve First-pass Silicon Leveraging SDC Verification Early with No Noise
International Test Conference – India, 2023
Radisson Blu Outer King Road, Bengaluru, IndiaInternational Test Conference is the world’s premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back to process and design improvement. At ITC India, design, test, and yield professionals can confront challenges… Read More »International Test Conference – India, 2023
ITC India 2023
Hotel Radisson Blu Marathalli ORR, Bengaluru, IndiaKeynote speakers Fadi Maamari VP of Engineering at Synopsys Sule Ozev Arizona State University About Us International Test Conference is the world’s premier venue dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, design-for-test, design-for-manufacturing, silicon debug, manufacturing test, system test, diagnosis, reliability and failure analysis, and back… Read More »ITC India 2023
Solution for 3D-IC Interposer Signal Integrity
Our upcoming CadenceTECHTALK: Solution for 3D-IC Interposer Signal Integrity is designed to teach engineers to translate a GDSII stream format (GDSII) file and partition it into simulation blocks for the Clarity 3D field solver. First, you will learn to use GDS-supporting files to simplify GDS to SPD translation and reuse those files to make the… Read More »Solution for 3D-IC Interposer Signal Integrity
Solution for 3D-IC Interposer Signal Integrity
3D-IC design requires early analysis of thermal properties, power delivery, and signal integrity. This webinar will work through the process of simulating heterogeneously integrated chiplets. Learn about the integrated workflow that begins with silicon design data being accurately modeled with 3D FEM extraction. The Cadence Clarity 3D Solver has the unique ability to efficiently import… Read More »Solution for 3D-IC Interposer Signal Integrity
A Novel Approach to Implementing Logical ECOs with Synopsys Formality ECO on High Performance RISC-V Cores
RTL engineering change order (ECO) is vital to ensuring proper functionality of integrated circuits (ICs). Retiming and auto ungrouping optimize RTL implementation and enhance PPA. However, aggressive optimizations in CPU RTL designs present challenges due to increased design complexity and potential mapping issues. Synopsys Formality ECO offers an efficient and accurate solution for RTL ECO… Read More »A Novel Approach to Implementing Logical ECOs with Synopsys Formality ECO on High Performance RISC-V Cores
EMC+SIPI 2023
DeVos Place 303 Monroe Ave NW, Grand Rapids, MI, United StatesEMC+SIPI 2023 leads the industry in providing state-of-the-art education on EMC and Signal Integrity and Power Integrity techniques. Don't miss out on this valuable opportunity to learn from and network with industry leaders and peers.
Accelerate Coverage Closure with Synopsys VSO.ai
70% of engineering time is spent verifying a design but it is largely a manual effort. As the industry faces ongoing engineering shortages companies are forced to make their engineering teams 10 times more productive at finding and isolating bugs per day. Increasing design complexities are also driving up the compute resources needed to verify… Read More »Accelerate Coverage Closure with Synopsys VSO.ai
An Introduction to Correct-by-Construction Golden Specification-based IP/SoC Development
This webinar explores front-end automation advances that encompass an innovative register information management system to capture hardware functionality and addressable register map in a single "executable" specification. Appropriate Audience: ● Architects/RTL Designers ● Verification Engineers ● Pre-Silicon Validation Teams ● Post-Silicon Lab Bring-up Team Members ● Technical Writers ● Firmware Engineers ● Embedded Programmers Learn… Read More »An Introduction to Correct-by-Construction Golden Specification-based IP/SoC Development
ISPLED 2023
TU Wien Gußhausstraße 27-29/384, Vienna, AustriaThe International Symposium on Low Power Electronics and Design (ISLPED) is the premier forum for presentation of innovative research in all aspects of low power electronics and design, ranging from process technologies and analog/digital circuits, simulation and synthesis tools, system-level design and optimization, to system software and applications.
Synopsys Static Verification SIG 2023
Synopsys 675 Almanor Ave, Sunnyvale, CA, United StatesJoin us in-person on August 8th for the Synopsys Static Verification Special Interest Group (SIG) event. This event provides an opportunity for users, managers, and enthusiasts to stay connected with the latest innovations, techniques and methodologies. Attendees will hear about groundbreaking and successful applications and deployments of Synopsys VC SpyGlass RTL static signoff solution. Full agenda coming soon!
Flash Memory Summit
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesWhy Attend Flash Memory Summit? Flash Memory Summit (FMS) is an all-inclusive international memory and storage showcase. It is the event for the memory and storage industry. It is the one-stop place to catch up on the latest technologies, see the hottest products, and learn about what's happening and where the latest trends are heading.… Read More »Flash Memory Summit