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  • Engineering best practices for Python-based testbenches with cocotb

    Writing code is easy. Reading code is hard. Maintaining code is hard. Writing "good" code is hard. So what's "good code"? Don't despair: the software engineering community has come up with tons of practical solutions! Now it's time to apply them to your next Python verification project with cocotb. In this talk, we'll look at… Engineering best practices for Python-based testbenches with cocotb

  • Super Computing 2022

    Kay Bailey Hutchison Convention Center 650 S Griffin Street, Dallas, TX, United States

    Come see your friends and colleagues, explore incredible learning experiences in HPC, and walk the exhibit floor! There are several registration options available. Choose the one that’s right for you. We look forward to seeing you in Dallas or via the Digital Experience.

  • Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs

    Signal integrity/power integrity (SI/PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards. Faster signoff of designs can be achieved by uncovering signal SI/PI issues early in the design process. This webinar will highlight three key issues engineers need to overcome to sign off on high-speed PCB designs: serial link compliance (SerDes), power… Three Issues Every EE Needs to Overcome to Sign Off on High-Speed PCB Designs

  • Semicon Europa

    Messe Munchen Messegelände, Munich, Germany

    SEMICON Europa 2022 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. - Top-notch Keynotes - Market Trends - Exhibition - Networking - Advanced Packaging Forum / Fab Management Forum - ITF Beyond 5G -powered by imec… Semicon Europa

  • The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

    As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16 at 9:00 a.m. PST for an informative webinar on The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions… The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging

  • ASIP University Day 2022

    Application-specific instruction set processors (ASIPs) have established themselves as an important implementation option for modern SoCs, i.e. when standard processor IP cannot meet challenging application-specific requirements, and fixed hardware is not flexible enough. Synopsys’ ASIP Designer is the market leading tool for ASIP design, verification and programming, and is used by leading companies around the… ASIP University Day 2022

  • TCAD Seminar 2022

    Join our online TCAD Seminar to learn about the application of Synopsys TCAD solutions to accelerate the research, development, and optimization of semiconductor technologies. The seminar sessions cover all major semiconductor technologies, from advanced logic and memory to analog, and power electronics. The solutions presented in this event are based on the industry-standard Sentaurus TCAD… TCAD Seminar 2022

  • CadenceLIVE Europe 2022

    Hilton Munich Park Am Tucherpark 7, Munich, Germany

    CadenceLIVE Europe 2022 will be held on November 21-22 at the Hilton Munich Park hotel. It will feature peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products. CadenceLIVE brings together users, developers, and industry experts to connect, share ideas, and inspire design creativity. Attendees will have the opportunity to attend captivating… CadenceLIVE Europe 2022

  • Asian Test Symposium 2022

    Evergreen Laurel Hotel Evergreen Laurel Hotel (Taichung)No. 666, Sec. 2 Taiwan Boulevard, Taichung, Taiwan

    The Asian Test Symposium (ATS) provides an open forum for researchers and industrial practitioners from all countries of the world to exchange innovative ideas on system, board, and device testing with design, manufacturing, and field consideration in mind.

  • Memory Technology Symposium

    Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. Why… Memory Technology Symposium

  • SEMISRAEL Expo 2022

    Avenue Convention Center Airport City, Israel

    SemIsrael Expo 2022 is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry. The Expo will host some 750 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups, local R&D offices of multinationals and IDMs, foundries,… SEMISRAEL Expo 2022

  • RISC-V Verification Strategies

    With the popularity of the RISC-V open architecture, many companies are looking for Verification Strategies for developing their own cores or how to verify their integration into a subsystem or SoC. Time Session Description Slides Videos 12.00 GMT Welcome and Introduction Mike Bartley, Senior Vice President – VLSI Design, Tessolve 12.05 GMT RISC-V processor verification… RISC-V Verification Strategies