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The IEEE Rising Stars Conference is designed to inform, excite, enthuse, and bring together the top engineering Young Professionals and Students around the world to network and be inspired by each other. The program includes Technical Innovation Talks, Professional Development, Workshops & Competitions, and Networking Opportunities with industry and peers. The conference gathers Technical Professionals who are experts in emerging technologies such as: Autonomous… IEEE Rising Stars 2024 |
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The 37th International Conference on VLSI Design & the 23rd International Conference on Embedded Systems (VLSID 2024) are being held at Kolkata, India, during January 6-10, 2024. VLSID 2024 is returning to the city after 8 years since 2016. This flagship conference is bringing worldwide industry leaders, Indian and international industry bodies, and academic researchers in a… VLSID 2024 |
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Registration is now open for CES® 2024 — taking place Jan. 9-12, in Las Vegas. Flip the switch on global business opportunity with CES, where you can meet with partners, customers, media, investors, and policymakers from across the industry and the world all in one place. Don't miss your chance to be a part of the most powerful tech… CES 2024 |
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About this Webinar Electronic components design and their integration on PCBs involve complex simulations to predict EM fields and forces accurately. These simulations can be computationally intensive and time-consuming. High-Performance Computing (HPC) capability built into Ansys Maxwell core technology significantly accelerates the electronic component design process, enabling quick iteration, optimization, and validation. The ECAD capability… Speed Up Your Electronic Component Design with HPC
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The RISC-V Day Tokyo conference is the largest RISC-V event in Japan. The RISC-V Day Tokyo 2024 Winter conference will be held on Tuesday, January 16, 2024 from 9:00-17:00 JST (UTC+9) at the Ito International Research Center, The University of Tokyo. We will bring together excellent RISC-V-related technologies and products, as well as key people… RISC-V Day, Tokyo 2024 Winter
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“Right first time” is a goal we all aspire to, but how often does it really happen? Even when we follow layout rules as closely as possible, problems creep into the layout that cause issues during lab testing and result in costly, time-consuming respins. Join our expert presenter Todd Westerhoff in this LinkedIn Live… PCB Design Best Practices: How to fully verify your Serdes-based designs before prototype manufacture |
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The heterogeneous integration of chips/chiplets has added significant complexity to the IC package design process, further compressing schedules for many design teams. Design teams must work more efficiently to meet quality and performance goals while maintaining schedule milestones. One way to improve efficiency is to shift signal and power integrity (SI/PI) analysis to earlier in… Meet Advanced IC Package Design Schedule Challenges with In-Design Analysis |
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ASP-DAC 2024 is the 29th annual international conference on VLSI design automation in Asia and South Pacific regions, one of the most active regions of design, CAD and fabrication of silicon chips in the world. The conference aims at providing the Asian and South Pacific CAD/DA and Design community with opportunities of presenting recent advances… ASP-DAC 2024 |
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Every project has some areas that seem impossible to cover. Various factors can cause these nearly impossible-to-hit coverage gaps, including technical complexity, lack of resources, and shifting requirements. In constrained random environments, simply running more random seeds may not always address these coverage gaps effectively. Overcoming these gaps requires creativity, persistence, and technical expertise. A… Verisium SimAI: Coverage Gaps Meet Their Match |
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Combination of exhibitions & conferences covering important topics in the automotive industry such as automotive electronics, connected car, autonomous driving, EV/HV/FCV, lightweight, processing technology and MaaS. Automotive OEMs and Tier 1 suppliers visit the exhibition to find suppliers and partners. 1,650 Exhibitors 85,000 Visitors 170 Speakers
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Applications such as Data Centers, High-Performance computing (HPC), artificial intelligence/machine learning (AI/ML), cloud computing, military, and aerospace, automotive, etc. are all extremely Bandwidth-hungry. To cater to such high demands of high speeds and bandwidth requires a breakthrough that HPC SoCs are constantly facing. High speed interfaces like PCI Express® (PCIe®) 5.0 and 6.0 show promising… Comprehensive PCIe Verification Solution for bleeding edge and mission critical SoC & IP Designs
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Whether you’re a beginner or a seasoned engineer, this webinar is a must-watch for anyone in the electronic design space. Join us to discuss how you can accelerate your PCB design process with our new and improved OrCAD X layout environment. Learn how you can: Design with an intuitive UI Collaborate using design review and markup… Introducing OrCAD X, Our Next-Generation PCB Layout Solution |
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Join us for an engaging webinar as we delve into the boundless possibilities of RISC-V architecture with a focus on the comprehensive Total Solutions offered by the Andes Series. Explore how these cutting-edge RISC-V CPU cores are reshaping the landscape of computing, powering innovations across diverse applications such as automotive and AI. Our experts will… Releasing All Potential of RISC-V: Total Solutions of Andes Core Processors Series
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Cadence’s Clarity 3D Solver is an industry-leading EM simulation platform used by hundreds of design teams to address signal and power integrity (SI/PI) challenges. By solving bigger problems on more efficient compute resources, Clarity 3D Solver users have reimagined what can be done with 3D finite element method (FEM) solver technology. However, EM extraction results to… Validating Clarity 3D Solver Accuracy Through Measurement Correlation
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AXI has become the most popular internal bus protocol with today’s FPGA and SoC FPGA designs. ALINT-PRO enables FPGA designers to extract, review and statically verify AXI bus interfaces. In addition, ALINT-PRO can assist with automatic generation of test harnesses for dynamic verification. For dynamic verification of AXI interconnects, Aldec provides FPGA vendor-agnostic AXI Bus… Verifying AXI Interconnects with ALINT-PRO and Riviera-PRO |
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The Must Attend Event for Chip, Board, and Systems Design Engineers DesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. 40 Under 40 Calling all Emerging Engineers and Leaders! DesignCon’s 40 Under 40 program launches in 2024 and provides… DesignCon 2024 |
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Dear SIPI Engineer, As a member of the engineering community, you are invited to attend Synopsys Signal & Power Integrity Special Interest Group event taking place at Hilton Santa Clara. This event is conveniently located across the street from the DesignCon 2024 Conference allowing you to participate in both. The Synopsys SIPI SIG event will… Signal & Power Integrity Special Interest Group |
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