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This DVClub event will have talks on verification of low power features of VLSI designs, discussing strategies for accurately measuring power consumption and ensuring that power-saving mechanisms are effective. Additionally, speakers will share insights on how to simulate and analyze different power scenarios to identify potential issues and optimize power management techniques. Attendees will have… DVClub Europe – September 2024 |
2 events,
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Are you ready to transform your career and become a master of analog layout design? Look no further than The Advanced Analog Layout Course! This course is meticulously crafted to enhance your physical design skills, guiding you through the advanced techniques essential for creating top-notch, well-matched, and noise-resistant layouts on a CMOS process. Learn Anytime, Anywhere! Our course is delivered through a user-friendly… Elevate Your Analog Layout Design to New Heights
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The defense industry is increasingly seeking innovative approaches to accelerate system development while ensuring reliability. Hardware-accurate digital twins offer a promising solution. This webinar will explore the concept of hardware-accurate digital twins and their application in defense. Join Cadence and Northrop Grumman as we delve into a real-world case study demonstrating the power of digital… Hardware-Accurate Digital Twins in Defense: Case Study |
3 events,
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As electronic systems continue to become more complex and integrate greater functionality, SoC developers are faced with the challenge of developing more powerful, yet more energy-efficient devices. The processors used in these applications must be efficient to deliver high levels of performance within limited power and silicon area budgets. Why Attend? Join us for… Synopsys Processor IP Summit 2024: RISC-V, DSP and NPU IP for Your Diverse SoC Processing Needs
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About this webinar Digital engineering is ramping up across the CPG, healthcare and wider packaging sector. Packaging engineers are tasked with producing fit-for-purpose packaging that is optimised for customer-use, transportation, storage and for production-line filling/handling. In addition, manufacturing the packaging containers as optimally as possible to avoid defects is vitally important. All in the landscape… Enhanced Packaging Performance and Manufacturing with Physics-Based 3D Simulation
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Abstract: This “Getting Started” presentation is for engineers who need to use the OSVVM AXI4 verification components (VCs) in their testbenches. Part 2 of this presentation focuses on how to write tests and configure the AXI4 VCs. AXI4 VCs are probably the most complex VCs in the OSVVM library. This complexity is due to the… Using OSVVM’s AXI4 Verification Components |
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The symposium focuses on Machine Learning (ML) for all aspects of CAD and electronic system design. The symposium is sponsored by both the ACM Special Interest Group on Design Automation (SIGDA) and the IEEE Council on Electronic Design Automation (CEDA). The symposium program will have keynote and invited speakers in addition to technical presentations. MLCAD… MLCAD Symposium 2024 
The AI Hardware & Edge AI Summit is the ultimate destination for the entire AI and ML ecosystem, with a collaborative mission to train, deploy and scale machine learning systems that are fast, affordable, and efficient. Whether it’s forging new partnerships, staying ahead of the ever-changing semi-conductor landscape, learning how to build, train, and deploy efficient systems,… AI Hardware & Edge AI Summit 2024
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A worldwide connected Event !! D&R IP-SoC South Korea 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next innovation… IP-SoC South Korea 24 |
4 events,
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Abstract As cameras become ubiquitous in applications such as surveillance, mobile, drones, and automotive systems, achieving clear vision 24/7 under any condition—including extreme low light and high dynamic range scenarios—has become essential. By leveraging Edge AI processors, a software ISP based on neural network technology can process and optimize video in real-time, surpassing human… Can AI make cameras see in the dark?
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Join us for an informative webinar as we unveil the new hybrid cloud capabilities of our cloud solutions designed to revolutionize EDA workloads. Whether you need peak capacity for a short duration or want a front-to-back turnkey cloud environment, our cloud solutions offer unparalleled flexibility and efficiency. We will discuss how Cadence True Hybrid Cloud… Faster Design TAT and Upscaled Team Productivity with Cadence’s True Hybrid Cloud |
3 events,
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Delve into how Questa Formal Verification IP (VIP) for the AMBA protocol ensures that designs incorporating AMBA adhere strictly to the protocol; all without the need for simulation. The solution integrates comprehensive protocol knowledge and provides user-friendly interfaces, significantly reducing the setup time for verification environments. Optimized for top-tier performance and scalability, Questa Formal VIP… Questa Formal Verification IP AMBA: Achieve Protocol Compliance in Designs |
6 events,
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The Verification Futures conference provides a unique blend of conference presentations, exhibitions, training and industry networking sessions dedicated to discussing the challenges faced in hardware and software verification. Verification Futures provides a unique opportunity for end-users to define their current and future verification challenges and collaborate with the vendors to create solutions. It also provides… Verification Futures Conference 2024 Austin
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D&R IP-SoC China 2024 Day is the unique worldwide event in China fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next innovation steps in the Electronic Industry.… D&R IP-SoC China 2024 Day
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Power network design and analysis of 3D-ICs is a major challenge because of the complex nature and large size of the power network. In addition, designers must deal with the complexity of routing power through the interposer, multiple dies, through-silicon vias (TSVs), and through-dielectric vias (TDVs). In this webinar, you will learn how the Cadence… Addressing 3D-IC Power Integrity Design Challenges |
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Our 10th ORConf! The FOSSi Foundation is proud to announce the 10th installment of ORConf, a conference dedicated to free and open source silicon to be held over the weekend of Friday September 13 to Sunday September 15 in Gothenburg, Sweden. ORConf is a weekend of presentations and networking for the open source silicon community.… ORConf 2024 |
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The EOS/ESD Symposium is dedicated to the understanding of issues related to electrostatic discharge and electrical transients/overstress, and the application of this knowledge to the solution of problems in consumer, industrial, and automotive applications, including electronic components, as well as in systems, subsystems, and equipment. |
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A worldwide connected Event !! D&R IP-SoC Japan 2024 Day is the unique worldwide Spring event fully dedicated to IP (Silicon Intellectual Property) and IP based Electronic Systems. IP-SoC providers, the seed of innovation in Electronic Industry, are invited to highlight their latest products and services and share their vision about the next innovation steps… IP-SoC Japan 24 |
5 events,
On behalf of the DVCon India 2024 steering committee, it is my pleasure to welcome you all to the 9th edition of the Design and Verification Conference in India planned from 18- 19th September 2024 in Bangalore, India. The theme of this year’s conference is “Architecture to Analytics – A2A“. We want to carry forward… DVCon India 2024
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Join us in this constraint-focused webinar to learn all the best practices for managing constraints in your design with OrCAD X Presto PCB Editor. We’ll cover everything from the basics of setting up spacing and physical constraints to advanced electrical constraints, which are critical for HDI designs. The webinar will feature a brief presentation, a… Managing Constraints Like a Pro in OrCAD X
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The Arm platform is providing the foundation for the next wave of AI smartphones and laptops. As AI models rapidly evolve, we’re seeing that software begins to outpace hardware, requiring additional innovation at all levels of the compute stack. To meet these growing demands, the Arm platform offers a new compute solution for maximum performance… Redefining Mobile Experiences with AI
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In this Training Webinar, explore the concepts of RTL design, design verification, and coverage analysis while unveiling the exciting world of front-end design flow. Walk through the essential steps in creating integrated circuits, the building blocks of modern electronics. This webinar provides practical knowledge, making it your gateway to understanding the magic behind RTL-to-GDSII front-end… A Beginner’s Guide to RTL-to-GDSII Front-End Flow |
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Time Speaker Details 09.30 Arrival and Registration 10.00 Dave Sanders, Rolls-Royce Overview of Rolls Royce @ Solihull Presentation Title - Rolls-Royce… the past, the present and the future Abstract - Rolls-Royce has come a long way since its inception as a car manufacturer at the start of the twentieth century, for starters it doesn’t make cars anymore!… FPGA Front Runner: FPGA Verification Strategies |
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The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for the presentation of leading-edge research and development in the area of process and device simulation. SISPAD is one of the longest-running conferences devoted to technology computer-aided design (TCAD) and advanced modeling of novel semiconductor devices and nano electronic structures.… SISPAD 2024
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Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… TSMC North America OIP Ecosystem Forum 2024 |
3 events,
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THE JOURNEY TO A $1T GLOBAL INDUSTRY The GSA US Executive Forum will delve into the semiconductor industry’s journey toward achieving the trillion-dollar milestone. The industry operates in a complex environment where global forces intersect with regional dynamics. Industry executives will explore the delicate balance between globalization and regionalization, considering both opportunities and challenges while… GSA U.S. Executive Forum 2024
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Are 2D-TMD-channel transistors suitable candidates for the replacement of silicon ? Considering the extreme scaling down to a few atomic layers of the FET channel, only an atomistic solution looks viable. In this context, we show how the Victory Atomistic tool can answer this essential question thanks to quantum mechanics, offering valuable support for the… Learn How to Simulate 2D-TMD-Channel FETs with Atomistic Precision |
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Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. … Memory Users Conference 2024
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ME-Pro™ is a unified tool for designers, process developers, modeling engineers, and PDK engineer providing robust simulation and analysis capabilities for semiconductor device model verification and evaluation. This comprehensive platform supports evaluation across device, circuit, and process domains enabling interactive development and offering critical feedback for process improvements. With decades of Primarius’ expertise, ME-Pro™ features… Interactive SPICE Model Verification Platform ME-Pro |
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Advancements in memory technology are fueling rapid growth in big data applications across AI, 5G, Automotive, and HPC. These demanding applications create many challenges for memory designers. Some long-standing challenges are exacerbated, while the latest technology nodes have introduced some new ones. At Synopsys, there is a corporate-wide commitment to developing broad-based solutions that address these challenges. … Memory Users Conference 2024 – China, Taiwan
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The Arm platform is providing the foundation for the next wave of AI smartphones and laptops. As AI models rapidly evolve, we’re seeing that software begins to outpace hardware, requiring additional innovation at all levels of the compute stack. To meet these growing demands, the Arm platform offers a new compute solution for maximum performance… Redefining Mobile Experiences with AI – Session 2 |
3 events,
EDPS 2024 is now taking shape. The place to be is once again SEMI, in Milpitas, and the dates are Thursday and Friday, Oct 3rd and 4th, 2024. Registration is now open: https://2024-ieee-edps.eventbrite.com. Who needs to register? Please see the Registration page. Talks from EDPS 2023 and the last 24 years of EDPS, are are available and… Electronic Design Process Symposium (EDPS) – 2024
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Register for the Synopsys VC Formal Special Interest Group (SIG) event today. This event provides an opportunity for users, managers, and enthusiasts to stay connected with the latest formal verification innovations, techniques and methodologies. Industry leaders such as Amazon, Black Sesame, Microsoft, NVIDIA, Samsung, and Untether AI will share their experiences with the latest formal… VC Formal Special Interest Group
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Join us at this year’s Synopsys Signoff SIG (Special Interest Group) event. Signoff is a critical quality control checkpoint in the chip development process, but design complexity and advance process nodes are pushing the boundaries of what is expected of signoff solutions. Meeting these scaling challenges is becoming more difficult. At this year’s Synopsys Signoff… Signoff Special Interest Group |
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