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The International Conference on Computer-Aided Design focuses on advancements and research in the field of electronic design automation (EDA) and computer-aided design (CAD) for integrated circuits and systems. Topics include innovations in design methodologies, tools, algorithms, and technologies related to the development of electronic systems. The International Conference on Computer-Aided Design focuses on advancements and… ICCAD 2024 |
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High Bandwidth Memory (HBM) has revolutionized AI, machine learning, and High-Performance Computing by significantly increasing data transfer speeds and alleviating performance bottlenecks. The introduction of next-generation HBM4 is especially transformative, enabling faster training and execution of complex AI models. JEDEC has announced that the HBM4 specification is nearing finalization. In this webinar, you will learn how… Verifying the next generation High Bandwidth Memory controllers for AI and HPC applications |
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International Test Conference, the cornerstone of TestWeek™ events, is the world’s premier conference dedicated to the electronic test of devices, boards and systems-covering the complete cycle from design verification, test, diagnosis, failure analysis and back to process and design improvement. At ITC, test and design professionals can confront the challenges the industry faces, and learn… ITC 2024 |
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Overview This seminar will update you on technologies and techniques you can adopt to increase your verification productivity today. Specifically, we will cover: How the new AI/ML paradigm shift across the industry is enabling functional verification productivity gains. Protocol and memory verification solutions you need for your next silicon verification project. Data-driven verification with automated… Verification Academy Live: Austin
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Join us for our first webinar in this insightful series, where we explore the rapidly evolving automotive landscape. We will focus on the rise of autonomous and electric vehicles, highlighting key trends such as ADAS, software-defined vehicles, and zonal architectures. Learn how Cadence’s advanced automotive solutions are addressing the increasing compute demands and in-vehicle networking… Navigating Trends and Tools in Automotive Design with Cadence
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The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. Electronic System… Phil Kaufman Award & Banquet |
3 events,
The APCCAS is a major international forum for researchers, scientists, educators, students and engineers to exchange their latest findings in circuits and systems. It covers a wide range of topics including, but not limited to the following： Artificial Intelligence Circuits, Systems, and Applications Digital Integrated Circuits and Systems Analog and Mixed Signal Circuits and Systems… APCCAS 2024
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The integration of COTS-IP (Commercial Off-The-Shelf Intellectual Property) components in FPGA-based Avionics systems can significantly speed up development and enhance performance. However, it also introduces unique challenges, as these components may not align with the strict aviation development assurance standards required for DO-254 compliance. This webinar will guide you through the process of balancing the… Navigating COTS-IP in DO-254: Strategies for Safe and Efficient FPGA Design |
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This event features top executives from around the world who describe the burning issues surrounding AI and how to solve our immediate problems, focusing on these core areas: AI applications and their required infrastructure Silicon to support AI applications Systems to support AI applications Security and Standards AI is critical to our future. Please join… IEEE World Technology Summit – AI INFRASTRUCTURE
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High-level design techniques and automation tools to address the limitations of traditional RTL, reduce verification times, improve performance, and manage growing design complexity—integrating seamlessly. What You'll Learn: This Lunch & Learn offers an in-depth look at Rise Design Automation tools and illustrates how high-level design and early verification techniques can bring value to your projects.… Rise Together Beyond RTL : Practical Techniques for Improving ASIC Design Efficiency and Early Verification |
3 events,
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The AI revolution and other application domains, like data centers, advanced wireless communications, image and video processing, automated driving assistance, and post-quantum cryptography need more powerful architectures with higher performance. This is driving demand for heterogeneous multicore systems including application specific instruction set processors (ASIPs). ASIPs have become a mainstream implementation option for modern SoCs,… ASIP University Day 2024: Domain-Specific Processor Design using ASIP Designer
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With the increasing importance of AI in engineering and the exciting potential for it’s use in Design Verification, Tessolve has been working on improving internal DV processes, with impressive reductions in both effort and costs, and with many clients to improve both efficiency and quality in DV through AI. In this series of 3 short… Tessolve AI Strategy & Eco System for DV |
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Join our webinar to discover how AI-driven optimization and automation in constraint generation can boost productivity and shorten design cycles for PCB and IC package design. Learn how integrating Allegro X and Sigrity X can streamline your workflow. Key Takeaways: Learn how the Sigrity Topology Workbench, a robust system-level SI/PI environment for what-if and pre-route… AI-Driven Constraint Generation for PCB and IC Package Design
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In a world where artificial intelligence and machine learning are embedded in critical applications—from real-time tracking and object detection to autonomous systems—the architecture behind these innovations must be both powerful and efficient. To help engineers and architects address these challenges, our upcoming webinar will demonstrate how System-Level Modeling can be a game-changer in optimizing the performance and… Optimize Systems and Semiconductor Architecture for Deep Learning Algorithms Using System-Level Modeling |
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Virtual! No registration fee! The WOSET workshop aims to galvanize the open-source EDA movement. The workshop will bring together EDA researchers who are committed to open-source principles to share their experiences and coordinate efforts towards developing a reliable, fully open-source EDA flow. The workshop will feature presentations and posters that overview existing or under-development open-source… Workshop on Open Source EDA Technologies (WOSET) |
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Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for A16, N2 and N3 processes Latest updates on TSMC 3DFabric™ chip stacking and advanced packaging processes, InFO, CoWoS®, and SoIC, 3DFabric Alliance, and 3Dblox™ standard, plus innovative 3Dblox-based design enablement technologies and solutions, targeting HPC, AI/ML, and mobile applications Comprehensive design… 2024 TSMC Europe OIP Ecosystem Forum
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The semiconductor industry is rapidly adopting 2.5D and 3D multi-die designs as the significant benefits have become clear for applications like HPC, GPU, mobile, and AI/ML. Multi-die design technology has been quickly evolving with early experiences leading to the development of more advanced implementation and analysis techniques. For the past years, Synopsys and Ansys have… Ansys-Synopsys Technology Update: The Latest Advances in Multi-Die Design |
4 events,
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Working with debugging scripts locally and manually can be challenging, as can reusing and organizing them. What if there was a way to create your own app with the required functionality and to register it with the tool? The answer lies in the Verisium Debug Python App Store. Instantly add additional features and capabilities to… Fast Track RTL Debug with the Verisium Debug Python App Store
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TGS offers a wonderful opportunity for networking, learning, and sharing the latest technology developments with our community, as well as meeting with Tower’s executives and team of experts. We invite you to join us! Time Session Speaker 9:00 – 10:00 Registration 10:00 – 10:05 Opening Mr. Lei Qin, SVP of Worldwide Sales 10:05 – 10:40… Tower Semiconductor – Technical Global Symposium 2024
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Join us for the Ansys IDEAS India User Conference 2024 — a place to catch up on industry best practices and the latest Semiconductor design advances. IDEAS will explore future trends with keynotes from industry leaders and offer technical insights from expert chip designers from many of the world’s top semiconductor companies. Overview At this… Ansys IDEAS User Conference India 2024 |
3 events,
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This session will explore Questa Verification IQ (VIQ), Siemens EDA’s next-generation collaborative and data-driven verification solution. VIQ revolutionizes the verification process by providing advanced analytics, enhanced collaboration, and comprehensive traceability. By leveraging machine learning, VIQ significantly enhances verification efficiency to boost your productivity. What you will learn: How to implement a collaborative, plan-driven verification process,… Boost your verification productivity with Questa Verification IQ
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This webinar to delve into the integrated design flow for power modules for electric vehicles (EVs) for enhanced functional safety and reliability. The power modules are distinguished by their high voltage and current requirements, substantial power dissipation, and the resulting temperature rise. Ensuring their safety and reliability is paramount. We will explore how Cadence’s cutting-edge… Accelerating Electric Vehicle Development: Integrated design flow for power modules with functional safety and reliability focus
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This event covers the challenges in ensuring an FPGA is secure and demonstrably safe as per the relevant industry safety standards. This includes supply chains, FPGA hardware and the IP used on the FPGA Agenda (GMT) Time Speaker Details 09.30 Arrival and registration 10.00 Tobias Adryan, Synopsys Securing FPGAs Beyond the Bitstream 10.30 Espen Tallaksen,… FPGA Front Runner: FPGA Safety and Security |
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This DVClub will consider how we can save time and effort whilst improving time-to-market through the application of AI/ML to design verification. Agenda (GMT): Time Session Description Slides Videos 12.00 GMT Welcome and Introduction – Mike Bartley, Tessolve Mike Bartley,Tessolve 12.00 GMT Hardik Raina, Agnisys, Inc - Genetic Algorithms for Automated Verification from VCD Data. 12.20… DVClub Europe – AI/ML in Verification |
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Webinar 3: Tessolve AI assisted advanced DV Flow and Use cases With the increasing importance of AI in engineering and the exciting potential for it’s use in Design Verification, Tessolve has been working on improving internal DV processes, with impressive reductions in both effort and costs, and with many clients to improve both efficiency and quality… Webinar 3: Tessolve AI assisted advanced DV Flow and Use cases |
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