ANSYS
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DesignCon 2023
Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United StatesDesignCon is the premier high-speed communications and system design conference and exposition, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley. Three days of education, exhibits, and networking – technical paper sessions, tutorials, industry panels, product demos, expo hall and social functions. Join fellow engineers at DesignCon and cover all aspects… DesignCon 2023
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Thermal Integrity Challenges and Solutions of Silicon Interposer Design
In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues, and methods for capturing these problems with simulation and virtual prototyping, with a focus on designs that utilize silicon interposers.… Thermal Integrity Challenges and Solutions of Silicon Interposer Design
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Power Integrity Issues and Solutions for Silicon Interposers
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with the dice instantiated in a 3D-IC device. The presentation will then explore the completed multi-chip design in a system simulation.… Power Integrity Issues and Solutions for Silicon Interposers
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Annual ESDA Membership Meeting & CEO Outlook
Keysight 5301 Stevens Creek Blvd, Building 5, Santa Clara, United StatesThe evening begins at the Keysight office, Thursday, May 18, at 5:00pm with the ESD Alliance Annual Membership Meeting. You'll get an overview of the past year's activities and discover what's in store for 2023. The meeting flows directly into a Welcome Reception followed by the powerful CEO Outlook. Enjoy a lively, nourishing networking reception that kicks off the CEO Outlook… Annual ESDA Membership Meeting & CEO Outlook
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SiFive Maximizes Compute Density With Its RISC-V Processor Cores
IP vendor SiFive has been at the forefront of RISC-V’s rapidly growing adoption across a wide array of markets and applications. In this joint presentation with Ansys, SiFive will describe how achieving maximum compute density - compute horsepower per mm2 and per mW (e.g SPECint2006/mm2) - has been a driving goal for SiFive’s portfolio of… SiFive Maximizes Compute Density With Its RISC-V Processor Cores
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International Microwave Symposium – IMS 2023
San Diego Convention Center 111 W. Harbor Drive, San Diego, CA, United StatesIMS will be presented in-person, 11-16 June 2023 in San Diego, CA. IMS is the flagship event in a week dedicated to all things microwaves and RF. The week also includes the IEEE MTT-S Radio Frequency Integrated Circuits Symposium (RFIC) and the Automatic Radio Frequency Techniques Group (ARFTG). 2023 Sponsors
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Run Ansys HFSS in the Cloud with AWS to Boost Simulation
About This Webinar Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products. Ansys HFSS is a 3D electromagnetic (EM) simulation software for designing and simulating high-frequency electronic products such as antennas, antenna arrays, RF or microwave components, high-speed interconnects,… Run Ansys HFSS in the Cloud with AWS to Boost Simulation
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SNUG Taiwan 2023
Sheraton Hsinchu Hotel No. 265號, E Section 1, Guangming 6th Rd, Zhubei City, TaiwanAs the electronics industry's largest user conference, SNUG Taiwan is dedicated to demonstrating the state-of-the-art innovations from the chip design community around the globe. This year, we are excited to announce that the SNUG Taiwan in-person event is back! SNUG Taiwan continues to foster the link between Synopsys’ tool users and technical experts so they… SNUG Taiwan 2023
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Designing for Six Sigma: Electronics Simulation Powered by Parametric Variation
The webinar focuses on the simulation-driven optimization of electronics, Integrated Circuits applications to achieve a six-sigma level of quality. Electronics are part of our daily life, with innovative and connected transportation, buildings, and communications. However, the design of electronic devices is a complex process, and achieving a six-sigma level of quality is a significant challenge.… Designing for Six Sigma: Electronics Simulation Powered by Parametric Variation
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Design and Analysis of Multi-Die & 3D-IC Systems
The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from TSMC, provide advantages by significantly reducing the interconnect length and signal power loss. These new technologies have introduced the need for innovative ways to solve… Design and Analysis of Multi-Die & 3D-IC Systems
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SFF & SAFE™ Forum 2023 San Jose, CA
Signia by Hilton 170 S Market Street, San Jose, CA, United StatesDay 1 June 27th, 2023 12:00 - 1:00pm PDT Networking Lunch & Registration 1:00 - 1:05pm PDT Opening Jinman Han EVP, Head of DSA Office, Samsung Electronics 1:05 - 1:20pm PDT Samsung Keynote Siyoung Choi President and GM, Foundry Business, Samsung Electronics 1:20 - 1:35pm PDT An Energy Efficient Future of AI Joe Macri SVP, CTO… SFF & SAFE™ Forum 2023 San Jose, CA
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3D-IC Foundry Frameworks
Join us on July 20th; Ansys R&D members will discuss an overview of the 3D-IC technology development frameworks offered by TSMC, Samsung, and Intel and how Ansys simulation tools and workflows fit into those frameworks. About this Webinar Semiconductor applications such as Mobile (5G), Automotive, and Datacenter (HPC, AI) demand better scaling, performance, and lower… 3D-IC Foundry Frameworks