Cadence Integrity

Electronic products with 3D-ICs face growing system challenges related to signal, power, and thermal integrity. Design density can lead to performance issues caused by heat, crosstalk, and power noise. In… CadenceTECHTALK: Overcoming System-Level 3D-IC Electrical and Thermal Challenges

A 3D-IC includes the package, interposer, multiple chiplets, through-silicon vias (TSVs), and through-dielectric vias (TDVs). Supplying power to the chiplets and dissipating heat through these various components poses a major… CadenceTECHTALK: 3D-IC Chip-Centric Power and Thermal Integrity with High-Performance Hierarchical Analysis

System planning is a major part of multi-chiplet design. Whether it’s a 2.5-D configuration with an interposer or full-stacked 3D design mounted on a package, it is important to have… CadenceTECHTALK: System Planning and Implementation for Different 3D-IC Design Styles