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Intel

THE FUTURE OF MORE THAN MOORE—Chiplets, Advanced Packaging, and More

Biamp Systems 9300 SW Gemini Dr., Beaverton, OR, United States

Presented by the SEMI Pacific Northwest and Silicon Valley Chapters How can we extend Moore's Law and drive new capabilities in the More than Moore era? The answer lies in the technology, economics, and new opportunities in the semiconductor supply chain. Join us at the Forum on Thursday, November 3, 2022, 8–11:30am Pacific Time to… Read More »THE FUTURE OF MORE THAN MOORE—Chiplets, Advanced Packaging, and More

Super Computing 2022

Kay Bailey Hutchison Convention Center 650 S Griffin Street, Dallas, TX, United States

Come see your friends and colleagues, explore incredible learning experiences in HPC, and walk the exhibit floor! There are several registration options available. Choose the one that’s right for you. We look forward to seeing you in Dallas or via the Digital Experience.

Semicon Europa

Messe Munchen Messegelände, Munich, Germany

SEMICON Europa 2022 is co-located with electronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain. - Top-notch Keynotes - Market Trends - Exhibition - Networking - Advanced Packaging Forum / Fab Management Forum - ITF Beyond 5G -powered by imec… Read More »Semicon Europa

GSA Awards Celebration

Santa Clara Convention Center 5001 Great America Parkway, Santa Clara, CA, United States

GSA recognizes semiconductor companies that have demonstrated excellence through their success, vision, strategy and future opportunities in the industry at its annual Awards Dinner Celebration. It is an honor to be selected as a nominee and an even more distinguished achievement to win a GSA Award.

IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)

The IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) symposium, a flagship event in the Asia-Pacific region, has consistently served as a platform for dissemination of latest research in the areas of electrical design of chip, package and system. Designers and researchers across the world come forth to share and discuss their work on… Read More »IEEE – Electrical Design of Advanced Packaging and Systems (EDAPS)

RISC-V Summit

San Jose Convention Center 150 W San Carlos Street, San Jose, CA, United States

Each day, thousands of engineers around the world collaborate and contribute to advance the most prolific open, license and royalty-free computing architecture. They share technical investment and help shape the architecture’s strategic future so everyone may create more rapidly, enjoy unprecedented design freedom, and substantially reduce the cost of innovation. Anyone, anywhere can benefit from the open intellectual… Read More »RISC-V Summit

EE Times – AI Everywhere Forum

Artificial intelligence (AI) is pervading almost every area of electronics today: from data centers, through edge accelerators to endpoint devices. Applications range from large scale analysis of medical data and online retail recommendation engines, to robotics and computer vision, to sensor fusion in the tiniest sensor nodes. The infusion of AI techniques into so many… Read More »EE Times – AI Everywhere Forum

CHIPS Alliance, Fall Technology Update

Join us in-person for our second biannual technology update featuring informative, technical talks on open source hardware collaborative development, hosted by Google and including speakers from Microsoft, Google, Intel, Antmicro, Efabless and others. CHIPS’ Thursday event follows the main RISC-V Summit days (Tuesday-Wednesday) to allow easy participation for open source hardware professionals traveling to the… Read More »CHIPS Alliance, Fall Technology Update

VLSID 2023

Hyderabad International Convention Cente Hyderabad, Telangana, India

International VLSI Design & Embedded Systems conference is a Premier Global conference with legacy of over three and half decades. This Global Annual technical conference that focusses on latest advancements in VLSI and Embedded Systems, is attended by over 2000 engineers, students & faculty, industry, academia, researchers, bureaucrats and government bodies. Semiconductors are the intangible… Read More »VLSID 2023

International Symposium on Field-Programmable Gate Arrays

Monterey Marriott 350 Calle Principal, Monterey, CA, United States

The ACM/SIGDA International Symposium on Field-Programmable Gate Arrays is a premier conference for presentation of advances in FPGA technology. In 2023, the 31st edition of FPGA will be held in Monterey, California, USA. Accepted papers will be published in the conference proceedings and available in the ACM Digital Library. At least one of the authors… Read More »International Symposium on Field-Programmable Gate Arrays

ISSCC 2023

Marriott Marquis 780 Mission Street, San Francisco, CA, United States

ISSCC 2023 is planned as a fully in-person event. On-demand access to ISSCC papers and educational material will be possible for people who cannot travel to San Francisco, but the conference will be optimized for an in-person experience. We keep monitoring the COVID-19 pandemic and we will promptly inform you should any change in our… Read More »ISSCC 2023

Hardware Security 2.0: What Are The New Frontiers?

The CAD for Trust and Assurance website is an academic dissemination effort by researchers in the field of hardware security. The goal is to assemble information on all CAD for trust/assurance activities in academia and industry in one place and share them with the broader community of researchers and practitioners in a timely manner, with… Read More »Hardware Security 2.0: What Are The New Frontiers?