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Rambus

CXL and IDE: Important Considerations of Protecting High Speed Interconnects

In a few short years, CXL (Compute Express Link) has evolved from an idea to a rapidly proliferating low latency interconnect standard being adopted into data centers, high performance computing, and cloud computing. However, as the adoption has increased, so has the security threat model users face. To address this, the CXL 2.0 standard has… Read More »CXL and IDE: Important Considerations of Protecting High Speed Interconnects

IP-SoC Conference 21

IP-SoC 2021 will be the 24th edition of the working conference fully dedicated to IP (Silicon Intellectual Property) and IP based electronic systems. The event is the annual opportunity for IP providers and IP consumers to share information about technology trends, innovative IP SoC products, Breaking IP/SoC News, Market evolution and more. The Grenoble event is… Read More »IP-SoC Conference 21

DVCON India

This conference will give you ample opportunities to share and highlight your technical contibutions in the areas of Verificaiton and Validations, Methodology & Automation, Functional Safety & Security, Low Power and Mixed Signal Design, Static and Formal methods and Digital Twins and SystemC Modeling.   Kindly use this opportunity and register yourself for the conference.… Read More »DVCON India

SemIsrael Tech Webinar

SemIsrael Expo is the premier professional semiconductor event in Israel. The event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry. The Expo will host some 750 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups, local R&D offices of multinationals and IDMs, foundries, design… Read More »SemIsrael Tech Webinar

Memory Bandwidth Races Higher with HBM3

With the formal release of the HBM3 specification, memory bandwidth for AI/ML and HPC shifts to a higher gear. Terabytes of bandwidth are possible using HBM3’s 2.5D/3D architecture. Join memory expert Frank Ferro as he discusses what changes come with the new generation of HBM, and how the Rambus HBM3 memory subsystem can help designers… Read More »Memory Bandwidth Races Higher with HBM3

Navigating the Intersection of Safety and Security

Vehicle systems and the semiconductors used within them are some of the most complex electronics seen today. Ensuring these systems are both functionally safe and secure from cyberattacks is mission critical. Join Siemens and Rambus to discuss how to secure your automotive electronics and ensure these solutions meet the requirements of ISO 26262. In this… Read More »Navigating the Intersection of Safety and Security

Rambus Design Summit 2022

Join us at Rambus Design Summit Back for its third year, the Rambus Design Summit is a virtual conference focused on the selection and implementation of chip and IP solutions for the data center, edge, automotive and IoT devices including the acceleration and security of AI/ML applications. Hear our technology leaders give their insights on… Read More »Rambus Design Summit 2022

IP-SOC China 22

The semiconductor world has to face a worldwide accelerated evolution, never seen before, both in terms of technology evolution (3D Packaging, advanced nodes) as well as new applications (IoT, Artificial Intelligence, Automotive, Security, etc) triggering an increasing demand of Semiconductor resources. D&R IP SoC Event Series is fully dedicated to IP (Silicon Intellectual property) and… Read More »IP-SOC China 22

U.S. Executive Forum

The 2022 GSA U.S. Executive Forum is coming up on September 27 in Menlo Park, California. USEF 2022 is one of the most anticipated GSA events of the year and attendance is filling up quickly. Make sure to secure your spot before it's too late. In this unique and exclusive gathering, thought leaders, visionaries and innovators… Read More »U.S. Executive Forum