Day 1 June 27th, 2023 12:00 – 1:00pm PDT Networking Lunch & Registration 1:00 – 1:05pm PDT Opening Jinman Han EVP, Head of DSA Office, Samsung Electronics 1:05 – 1:20pm PDT Samsung Keynote Siyoung Choi President… SFF & SAFE™ Forum 2023 San Jose, CA
The webinar focuses on the simulation-driven optimization of electronics, Integrated Circuits applications to achieve a six-sigma level of quality. Electronics are part of our daily life, with innovative and connected transportation, buildings, and communications. However,… Designing for Six Sigma: Electronics Simulation Powered by Parametric Variation
The architecture and heterogeneous integration capability of 3D-IC (three-dimensional integrated circuits) offer many benefits. The latest configuration methods, CoWoS (Chip On Wafer on Substrate) and WoW (Wafer on Wafer) from TSMC, provide advantages by significantly… Design and Analysis of Multi-Die & 3D-IC Systems
IP vendor SiFive has been at the forefront of RISC-V’s rapidly growing adoption across a wide array of markets and applications. In this joint presentation with Ansys, SiFive will describe how achieving maximum compute density… SiFive Maximizes Compute Density With Its RISC-V Processor Cores
As the electronics industry’s largest user conference, SNUG Taiwan is dedicated to demonstrating the state-of-the-art innovations from the chip design community around the globe. This year, we are excited to announce that the SNUG Taiwan… SNUG Taiwan 2023
IMS will be presented in-person, 11-16 June 2023 in San Diego, CA. IMS is the flagship event in a week dedicated to all things microwaves and RF. The week also includes the IEEE MTT-S Radio Frequency… International Microwave Symposium – IMS 2023
Join us on May 17 for the latest 3D-IC webinar series, “Power Integrity Challenges and Solutions for Interposer Design.” The discussion will focus on interposer power analysis as an isolated case and in context with… Power Integrity Issues and Solutions for Silicon Interposers
The evening begins at the Keysight office, Thursday, May 18, at 5:00pm with the ESD Alliance Annual Membership Meeting. You’ll get an overview of the past year’s activities and discover what’s in store for 2023. The meeting flows… Annual ESDA Membership Meeting & CEO Outlook
About This Webinar Engineers worldwide use Ansys HFSS software to design high-frequency, high-speed electronics found in communications systems, advanced driver assistance systems (ADAS), satellites, and internet-of-things (IoT) products. Ansys HFSS is a 3D electromagnetic (EM)… Run Ansys HFSS in the Cloud with AWS to Boost Simulation
In this latest installment of the year-long 3D-IC webinar series, Dr. Lang Lin will discuss the Thermal Integrity issues associated with 3D-IC designs. The presentation will cover thermal hotspots, mechanical stresses induced by thermal issues,… Thermal Integrity Challenges and Solutions of Silicon Interposer Design