Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets…
On February 20, 2025 in Cairo, Egypt, we are hosting the GSA MENA Executive Summit to look beyond the current divisions and rather recognize the Middle East North Africa regional potential as a source of capital and destination…
Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover how Cadence is empowering customers to achieve unparalleled success with…
Chiplets, also known as heterogeneous multi-die systems, are increasingly seen as the future of System on Chips (SoCs). They offer a solution to meet the growing demands of high-performance computing in various industries, particularly fueled…
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build “software-defined solutions” that are differentiated in their respective markets. Sign up and save your spot for this special presentation. Overview With…
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find…
UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration.…
I had the pleasure to attend the SEMI event held November 2nd in Beaverton, Oregon, just a few miles away from where I live in Tualatin. Biamp hosted the meeting, and their company has been…
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design…
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16…