Abstract The integrated circuit industry faces new challenges as chip complexity and area have been increasing to prohibitive ranges. Some segments have been adopting then a relatively new paradigm for heterogeneous integration based on chiplets… Signal and Power Integrity Challenges in Advanced Packaging Technologies for Disaggregated Integration
On February 20, 2025 in Cairo, Egypt, we are hosting the GSA MENA Executive Summit to look beyond the current divisions and rather recognize the Middle East North Africa regional potential as a source of capital and destination… GSA Mena Executive Summit
Step into the forefront of innovation with our upcoming webinar, which explores how chiplet technology is revolutionizing the automotive industry and setting new benchmarks. Discover how Cadence is empowering customers to achieve unparalleled success with… Accelerating SoC Automotive Design with Chiplets
Chiplets, also known as heterogeneous multi-die systems, are increasingly seen as the future of System on Chips (SoCs). They offer a solution to meet the growing demands of high-performance computing in various industries, particularly fueled… Chiplets: Building the Future of SoCs
From fintech to automotive, defense to healthcare, everyone wants bespoke computing platforms to build “software-defined solutions” that are differentiated in their respective markets. Sign up and save your spot for this special presentation. Overview With… The Era of Software-Defined Everything: Chiplets and Bespoke Silicon
The heterogeneous integration of chips and chiplets in IC packages is all the rage as we face “More than Moore” performance challenges. While these innovative design practices successfully address performance goals, some design teams find… Proactively Address Thermal Concerns in Advanced IC Packages
UCIe™ — Universal Chiplet Interconnect Express™ — is an open industry standard founded by the leaders in semiconductors, packaging, IP suppliers, foundries, and cloud service providers to address customer requests for more customizable package-level integration.… Introduction to UCIe
I had the pleasure to attend the SEMI event held November 2nd in Beaverton, Oregon, just a few miles away from where I live in Tualatin. Biamp hosted the meeting, and their company has been… SEMI: The Future of More than Moore
Learn About: Emerging advanced node design challenges and corresponding design flows and methodologies for N3/N3E, N4/N4P, N5/N5A, N6/N7, N12e, N22, and 28eF technologies Latest 3DIC chip stacking and advanced packaging processes, and innovative 3DIC design… TSMC 2022 EU OIP Ecosystem Forum
As the semiconductor industry adopts chiplets and heterogeneous integration for its packaging as a key enabler to the continuation of scaling beyond Moore’s law, it has created new challenges. Join us on Wednesday, November 16… The Era of Chiplets and Heterogeneous Integration: Challenges and Emerging Solutions to Support 2.5D and 3D Advanced Packaging