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CES 2023

CES 2024

Registration is now open for CES® 2024 — taking place Jan. 9-12, in Las Vegas. Flip the switch on global business opportunity with CES, where you can meet with partners, customers, media, investors, and policymakers from across the industry… CES 2024

IESA AI Summit 2023

IESA AI Summit

Experience the unprecedented growth opportunities in the semiconductor and electronics industry, fueled by rapid advancements in Artificial Intelligence (AI). Embrace the paradigm shift from software-centric approaches to hardware-centric solutions, captivating emerging markets in the realm… IESA AI Summit

Synopsys, November 9, 2023

Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems

Join industry experts from aerospace, government, and defense as they discuss the complexities of 3D Heterogeneous Integration (3DHI), highlighting some of the technological, manufacturing, and economic complexities as well as security, reliability, and safety challenges. … Tackling Challenges in 3D Heterogenous Integrated (3DHI) Microelectronics for Aerospace, Government, and Defense Systems

IDEAS 2023

Innovative Designs Enabled by Ansys Solutions – IDEAS 2023

ANSYS’ VIRTUAL USER CONFERENCE FOR ELECTRONICS, SEMICONDUCTORS AND PHOTONICS DESIGNERS Join us for the IDEAS Digital Forum — a place to catch up on industry best practices and the latest semiconductor, electronic, and photonic design… Innovative Designs Enabled by Ansys Solutions – IDEAS 2023

UCIe, October 12, 2023

The UCIe™ 1.1 Specification: Future Applications of Chiplets

Presenter: Dr. Debendra Das Sharma, UCIe Consortium Chairman and Intel Senior Fellow, Chief Architect of I/O Technology and Standards at Intel  The UCIe™ (Universal Chiplet Interconnect Express™) 1.1 Specification was released in August 2023, delivering valuable… The UCIe™ 1.1 Specification: Future Applications of Chiplets

FPGAworld 2023

FPGAworld Conference 2023 – Copenhagen

The FPGAworld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational & industrial cases, and more. Registration for attendees… FPGAworld Conference 2023 – Copenhagen

Synopsys, August 31, 203

Accelerating Mainstream Adoption of Multi-Die Systems

Synopsys recently hosted a panel discussion with Ansys, Bosch, Intel, and Samsung to share their insights on the rapid adoption of multi-die systems. We invite you to the public broadcast of the panel where each… Accelerating Mainstream Adoption of Multi-Die Systems